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SN74AS151J

Texas Instruments

SN74AS151J by Texas Instruments

SN74AS151J by Texas Instruments is an 8-input TTL multiplexer with a ceramic package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. With 16 terminals in an in-line rectangular package style, this device offers high performance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,863 parts In-Stock

1+ parts

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3,863

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Digiode

USA . 1,494 parts In-Stock

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1,494

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Distributors (Availability)

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AZTECH Wire

Italy . 633 parts In-Stock

1+ parts

$6.792

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633

$6.792

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Parana Technologies

USA . 251 parts In-Stock

1+ parts

$7.796

100+ parts

-

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$8.344

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251

$7.796

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$8.344

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DigiPath Technology Company

USA . 2,200 parts In-Stock

1+ parts

$8.585

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2,200

$8.585

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ChromeModa Solutions

Germany . 3,818 parts In-Stock

1+ parts

$8.760

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$7.183

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3,818

$8.760

$7.183

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IDEA Electronic Components Group

UK . 1,236 parts In-Stock

1+ parts

$8.760

100+ parts

$8.322

1k+ parts

$7.884

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1,236

$8.760

$8.322

$7.884

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One Stop Electronics

USA . 1,095 parts In-Stock

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$20.000

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1,095

$20.000

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Corphita

USA . 1,234 parts In-Stock

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1,234

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Overview

Unlock the power of precision with the SN74AS151J by Texas Instruments. Designed with top-quality materials and cutting-edge technology, this multiplexer & demultiplexer offers unparalleled performance for a wide range of applications. With 8 inputs and 16 terminals, this versatile component is perfect for commercial-grade projects that require seamless integration and reliability. Trust in Texas Instruments to deliver innovative solutions that exceed expectations. Choose the SN74AS151J for unbeatable value, superior benefits, and unmatched advantages.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and durability, making the product suitable for high temperature environments.

No. of Inputs: 8

Having 8 inputs allows for versatile multiplexing and demultiplexing capabilities, accommodating multiple input sources.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing electronic systems or circuits.

No. of Terminals: 16

With 16 terminals, there are ample connection options for interfacing with other components in a system.

Package Style (Meter): IN-LINE

In-line package style simplifies the installation and wiring process, ensuring efficient operation.

Maximum Operating Temperature: 70 °C

The product can reliably function at temperatures up to 70°C, suitable for a wide range of operating environments.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C ensures functionality in colder conditions as well.

Terminal Position: DUAL

Dual terminal position provides flexibility in component placement and connection, enabling optimal circuit design.

Temperature Grade: COMMERCIAL

Commercial-grade temperature tolerance ensures reliable performance in standard operating conditions.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, enhancing the overall efficiency of the product.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure and stable connections, reducing the risk of disconnection or signal loss.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for easy and precise soldering or connection, facilitating installation and maintenance.

Technical Specifications

Multiplexer & Demultiplexer SN74AS151J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74AS151J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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