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SN74ALS253DR

Texas Instruments

SN74ALS253DR by Texas Instruments

SN74ALS253DR by Texas Instruments is a TTL technology multiplexer/demultiplexer with 2 functions, 4 inputs, and 4 bits. It has a propagation delay of 21 ns at nominal voltage of 5V. This small outline package is ideal for commercial applications requiring fast signal switching in a compact form factor.

Median Price

$0.732

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,500 parts In-Stock

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$0.732

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Vyrian

USA . 8,467 parts In-Stock

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Bristol Electronics

USA . 4,593 parts In-Stock

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PC Components Company LLC

USA . 2,500 parts In-Stock

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TME

Poland . 2,500 parts In-Stock

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Inland Empire Components Inc.

USA . 2,228 parts In-Stock

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Resion

USA . 1,683 parts In-Stock

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Maverick Electronics, Inc.

USA . 960 parts In-Stock

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Digiode

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Inventory MP

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Microchip USA

USA . 1,670 parts In-Stock

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$4.750

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Parana Technologies

USA . 1,688 parts In-Stock

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$9.883

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$10.451

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DigiPath Technology Company

USA . 2,046 parts In-Stock

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$10.882

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$10.011

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ChromeModa Solutions

Germany . 2,859 parts In-Stock

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$11.104

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IDEA Electronic Components Group

UK . 947 parts In-Stock

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$11.104

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$10.549

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$9.994

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947

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AZTECH Wire

Italy . 620 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,449 parts In-Stock

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Corphita

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Metaverse IC Inc.

Canada . 1,288 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the Texas Instruments SN74ALS253DR Multiplexer & Demultiplexer. Designed with precision and reliability in mind, this product offers unparalleled performance in a variety of applications. From telecommunications to industrial automation, this versatile component delivers superior quality and efficiency. Experience the value of quick propagation delay, multiple functions, and robust design that Texas Instruments is known for. Upgrade your projects with the SN74ALS253DR and discover the difference that top-of-the-line technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, ideal for portable or long-lasting applications.

Propagation Delay At Nominal Supply: 21 ns

The low propagation delay ensures fast and efficient signal processing, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having multiple functions in one component saves on board space and simplifies circuit design, making this product a cost-effective choice.

No. of Inputs: 4

The multiple input channels provide flexibility in connecting various input sources, making this multiplexer/demultiplexer versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes it compatible with standard electronic systems and power sources.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance state when not in use, reducing power consumption and signal interference in multi-device circuits.

Technology: TTL

Using TTL technology ensures compatibility with a wide range of digital systems, making it a reliable choice for various applications.

Technical Specifications

Multiplexer & Demultiplexer SN74ALS253DR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

12 mA

Propagation Delay At Nominal Supply:

21 ns

Propagation Delay (tpd):

21 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexer

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74ALS253DR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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