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SN74AHC157RGYRG4

Texas Instruments

SN74AHC157RGYRG4 by Texas Instruments

SN74AHC157RGYRG4 by Texas Instruments is a CMOS multiplexer with 4 functions and 2 inputs. It has a propagation delay of 9.5 ns at 3.3V, making it ideal for industrial applications requiring fast signal switching in compact spaces. With a package size of 4x3.5mm and surface mount capability, it offers efficient integration into electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,821 parts In-Stock

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Digiode

USA . 2,566 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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AZTECH Wire

Italy . 265 parts In-Stock

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$7.563

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$7.563

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Parana Technologies

USA . 392 parts In-Stock

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$9.638

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$895.017

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$8.674

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392

$9.638

$895.017

$8.674

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DigiPath Technology Company

USA . 229 parts In-Stock

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$10.612

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$9.763

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229

$10.612

$9.763

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ChromeModa Solutions

Germany . 3,730 parts In-Stock

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$10.829

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$8.880

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$10.829

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IDEA Electronic Components Group

UK . 1,669 parts In-Stock

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$10.829

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$10.288

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$9.746

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$9.746

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Corohmni

South Africa . 223 parts In-Stock

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$19.638

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One Stop Electronics

USA . 407 parts In-Stock

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$33.000

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407

$33.000

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Semicontronic

India . 1,535 parts In-Stock

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$41.000

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$39.975

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$39.770

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1,535

$41.000

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Ampacity Inc.

Singapore . 1,485 parts In-Stock

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$57.000

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Continental Prestige Electronics

USA . 1,933 parts In-Stock

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Argo Parts USA

USA . 317 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Corphita

USA . 143 parts In-Stock

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Modulus Dynamics

Lithuania . 32 parts In-Stock

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Overview

Upgrade your electronic projects with the SN74AHC157RGYRG4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This multiplexer/demultiplexer offers unparalleled performance and reliability, making it perfect for a wide range of applications. With its fast propagation delay, low power consumption, and compact design, this chip is a must-have for any tech enthusiast looking to take their creations to the next level. Trust Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for long-term usage.

Propagation Delay At Nominal Supply: 9.5 ns

Low propagation delay ensures efficient and fast signal processing within the multiplexer/demultiplexer.

Surface Mount: YES

Surface mount compatibility allows for easy installation and integration into circuit boards.

No. of Functions: 4

Having 4 functions in one component saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for use in various industrial environments without risk of overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer SN74AHC157RGYRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16/20,.14X.16,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

SN74AHC157RGYRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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