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7601001EX

Texas Instruments

7601001EX by Texas Instruments

The Texas Instruments 7601001EX is an 8-input multiplexer with a propagation delay of 67ns. It operates in a temperature range of -55 to 125°C, making it suitable for military applications. The package style is in-line with a ceramic and metal-sealed co-fired body material.

Median Price

$3.827

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 13 parts In-Stock

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$3.827

100+ parts

$4.018

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$3.788

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13

$3.827

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Vyrian

USA . 4,666 parts In-Stock

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Digiode

USA . 2,643 parts In-Stock

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Anansix

USA . 1,792 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 728 parts In-Stock

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$7.988

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728

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Parana Technologies

USA . 366 parts In-Stock

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$10.830

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$11.307

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366

$10.830

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DigiPath Technology Company

USA . 2,173 parts In-Stock

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$11.925

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$10.971

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ChromeModa Solutions

Germany . 2,418 parts In-Stock

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$12.168

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$9.978

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2,418

$12.168

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IDEA Electronic Components Group

UK . 437 parts In-Stock

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$12.168

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$11.560

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$10.951

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437

$12.168

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Native Components

USA . 471 parts In-Stock

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$12.871

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471

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Northwest PG Solutions

USA . 839 parts In-Stock

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$14.158

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$12.742

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839

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One Stop Electronics

USA . 1,625 parts In-Stock

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$26.000

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Corphita

USA . 4,015 parts In-Stock

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Overview

Elevate your electronic projects with the top-quality 7601001EX by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures precision and reliability in every product. The 7601001EX falls under the category of Multiplexers & Demultiplexers, offering versatility and efficiency in various applications. With its MIL-STD-883 screening level and military-grade temperature grade, this product guarantees superior performance even in harsh conditions. Experience seamless operation and enhanced functionality with the 7601001EX, a valuable investment that brings endless benefits to customers.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired package body materials ensure durability and reliability in harsh environments.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 screening level assures high quality and performance standards for military applications.

No. of Inputs: 8

8 inputs provide versatility and flexibility in handling multiple input signals efficiently.

Nominal Supply Voltage / Vsup (V): 5

Stable nominal supply voltage of 5V ensures consistent and reliable operation.

No. of Terminals: 16

16 terminals offer sufficient connectivity options for various input and output configurations.

Propagation Delay (tpd): 67 ns

Low propagation delay of 67 ns ensures quick signal processing and minimal latency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C allows for reliable performance even in extreme temperature conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C enables operation in cold environments without compromising functionality.

Technology: TTL

TTL technology offers high speed and low power consumption, making it suitable for a wide range of applications.

Technical Specifications

Multiplexer & Demultiplexer 7601001EX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-CDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

67 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

7601001EX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-262-9874, 5962012629874

NIIN

012629874

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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