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7601101FX

Texas Instruments

7601101FX by Texas Instruments

The Texas Instruments 7601101FX is a dual-function multiplexer with 4 inputs, TTL technology, and a propagation delay of 26ns. It operates in military-grade temperatures from -55 to 125°C, making it suitable for high-reliability applications in harsh environments. With a flatpack package style and ceramic body material, this device is ideal for space-constrained designs requiring fast signal switching.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,102 parts In-Stock

1+ parts

-

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8,102

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Digiode

USA . 3,797 parts In-Stock

1+ parts

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3,797

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 516 parts In-Stock

1+ parts

$5.000

100+ parts

-

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516

$5.000

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AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$6.003

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292

$6.003

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Parana Technologies

USA . 1,945 parts In-Stock

1+ parts

$22.660

100+ parts

-

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$23.316

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1,945

$22.660

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$23.316

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DigiPath Technology Company

USA . 1,901 parts In-Stock

1+ parts

$24.952

100+ parts

-

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1,901

$24.952

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ChromeModa Solutions

Germany . 1,172 parts In-Stock

1+ parts

$25.461

100+ parts

$20.878

1k+ parts

-

10k+ parts

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1,172

$25.461

$20.878

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IDEA Electronic Components Group

UK . 1,065 parts In-Stock

1+ parts

$25.461

100+ parts

$24.188

1k+ parts

$22.915

10k+ parts

-

1,065

$25.461

$24.188

$22.915

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Northwest PG Solutions

USA . 2,313 parts In-Stock

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2,313

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Corphita

USA . 1,435 parts In-Stock

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1,435

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Native Components

USA . 979 parts In-Stock

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979

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Overview

Upgrade your electronic projects with the 7601101FX by Texas Instruments, a top-quality multiplexer & demultiplexer designed to meet MIL-STD-883 screening levels. With its durable ceramic, glass-sealed package and advanced TTL technology, this versatile component offers reliable performance in extreme temperatures. Ideal for a wide range of applications, from industrial automation to aerospace systems, this Texas Instruments product ensures seamless signal routing and efficient data processing. Experience the unbeatable value and precision that only Texas Instruments can deliver with the 7601101FX.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability.

No. of Functions: 2

Allows for multiplexing and demultiplexing of signals in the same component, saving space and cost.

No. of Inputs: 4

Offers flexibility in managing multiple input signals efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common voltage level, making it easy to integrate into existing systems.

Propagation Delay (tpd): 26 ns

Provides fast signal processing, reducing latency in data transmission.

Technology: TTL

Utilizes transistor-transistor logic technology for reliable and low-power operation.

Technical Specifications

Multiplexer & Demultiplexer 7601101FX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F16

Length:

10.16 mm

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT APPLICABLE

Propagation Delay (tpd):

26 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

6.73 mm

Trade Compliance

7601101FX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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