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7601601FX

Texas Instruments

7601601FX by Texas Instruments

7601601FX by Texas Instruments is a MIL-STD-883 compliant multiplexer with 8 inputs, 3-STATE output, and 75ns propagation delay. It operates b/w -55 to 125°C, suitable for military applications requiring high reliability in harsh environments. The flatpack package with ceramic body and dual terminals ensures robust performance in demanding conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,541 parts In-Stock

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Digiode

USA . 2,782 parts In-Stock

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Parana Technologies

USA . 2,239 parts In-Stock

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$13.251

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$13.756

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$13.251

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$13.756

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DigiPath Technology Company

USA . 332 parts In-Stock

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$14.591

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$13.424

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332

$14.591

$13.424

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ChromeModa Solutions

Germany . 2,521 parts In-Stock

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$14.889

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$12.209

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$14.889

$12.209

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IDEA Electronic Components Group

UK . 2,280 parts In-Stock

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$14.889

100+ parts

$14.145

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$13.400

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2,280

$14.889

$14.145

$13.400

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One Stop Electronics

USA . 1,335 parts In-Stock

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$15.000

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$15.000

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AZTECH Wire

Italy . 872 parts In-Stock

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$16.685

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Corphita

USA . 4,273 parts In-Stock

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Northwest PG Solutions

USA . 1,156 parts In-Stock

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Native Components

USA . 133 parts In-Stock

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Overview

Elevate your circuit designs with the 7601601FX by Texas Instruments, a high-quality multiplexer & demultiplexer that offers unparalleled performance and reliability. Crafted with precision in a ceramic, glass-sealed package, this versatile component is perfect for military-grade applications with its MIL-STD-883 screening level. With 8 inputs and 3-STATE output characteristics, this flatpack style device ensures efficient signal processing with a fast propagation delay of just 75 ns. Trust Texas Instruments to deliver cutting-edge technology that meets your needs, making the 7601601FX an essential choice for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides excellent protection and durability, ensuring reliability in harsh environmental conditions.

Surface Mount: YES

The surface mount capability allows for easy integration into PCBs, saving space and simplifying the overall design.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer can handle a greater amount of data, making it suitable for applications requiring multiple input signals.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this multiplexer/demultiplexer is compatible with standard power sources and can be easily incorporated into existing systems.

Propagation Delay (tpd): 75 ns

The low propagation delay of 75ns ensures fast signal processing, making this multiplexer/demultiplexer suitable for high-speed applications.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this multiplexer/demultiplexer offers enhanced reliability and performance in demanding environments.

Technology: BIPOLAR

Utilizing bipolar technology, this multiplexer/demultiplexer delivers high-speed operation and efficient signal processing, ideal for advanced electronics applications.

Technical Specifications

Multiplexer & Demultiplexer 7601601FX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F16

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

75 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

7601601FX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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