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SN74LV157ADRG4

Texas Instruments

SN74LV157ADRG4 by Texas Instruments

SN74LV157ADRG4 by Texas Instruments is a CMOS multiplexer with 4 functions and 2 inputs. It has a propagation delay of 15 ns and operates at a nominal voltage of 2.5V. This IC is commonly used in industrial applications due to its small outline package and wide temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,020 parts In-Stock

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Digiode

USA . 2,507 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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Parana Technologies

USA . 1,427 parts In-Stock

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$9.536

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$10.133

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$9.536

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AZTECH Wire

Italy . 411 parts In-Stock

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$9.774

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DigiPath Technology Company

USA . 1,640 parts In-Stock

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$10.501

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$9.661

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ChromeModa Solutions

Germany . 5,925 parts In-Stock

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$10.715

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$8.786

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$8.786

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IDEA Electronic Components Group

UK . 2,081 parts In-Stock

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$10.715

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$10.179

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$9.644

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One Stop Electronics

USA . 533 parts In-Stock

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$33.000

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Ampacity Inc.

Singapore . 1,367 parts In-Stock

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Continental Prestige Electronics

USA . 5,396 parts In-Stock

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Corphita

USA . 4,163 parts In-Stock

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Argo Parts USA

USA . 3,977 parts In-Stock

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Microchip USA

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Aranea Global

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Overview

Discover the SN74LV157ADRG4 by Texas Instruments, a high-quality multiplexer that offers numerous advantages and benefits for your applications. As a trusted manufacturer in the industry, Texas Instruments delivers exceptional products that meet the highest standards of performance and reliability. With its compact size and surface mount capability, this multiplexer is perfect for a wide range of applications. Whether you need to route signals or select between multiple inputs, the SN74LV157ADRG4 provides efficient and accurate functionality. Its low propagation delay ensures quick response times, while its true output polarity guarantees precise signal transmission. Trust Texas Instruments to deliver value, quality, and innovation with the SN74LV157ADRG4 multiplexer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, making the product suitable for long-term use in various conditions.

Propagation Delay At Nominal Supply: 15 ns

Low propagation delay ensures fast and efficient operation, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Having multiple functions in a single component can streamline circuit design and reduce component count, leading to cost savings and improved efficiency.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a low voltage, making it energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

The product can withstand high temperatures, ensuring reliable performance in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product more energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer SN74LV157ADRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74LV157ADRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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