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SN74CBT3257PWG4

Texas Instruments

SN74CBT3257PWG4 by Texas Instruments

SN74CBT3257PWG4 by Texas Instruments is a 4-function multiplexer with 3-STATE output characteristics. It operates at a supply voltage range of 4V to 5.5V and has a propagation delay of 0.35ns, making it suitable for industrial applications requiring fast signal switching in compact spaces. This CMOS technology-based device comes in a small outline package with dual terminal position and nickel palladium gold finish.

Median Price

$0.612

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$0.601

1k+ parts

$0.499

10k+ parts

$0.445

900

-

$0.601

$0.499

$0.445

Verical

USA . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.624

10k+ parts

$0.556

900

-

-

$0.624

$0.556

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.261

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.261

-

-

-

Digiode

USA . 1,211 parts In-Stock

1+ parts

$0.277

100+ parts

-

1k+ parts

-

10k+ parts

-

1,211

$0.277

-

-

-

Chip Stock

USA . 13,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,550

-

-

-

-

Vyrian

USA . 2,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,525

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 790 parts In-Stock

1+ parts

$0.248

100+ parts

$0.242

1k+ parts

$0.241

10k+ parts

-

790

$0.248

$0.242

$0.241

-

Continental Prestige Electronics

USA . 3,738 parts In-Stock

1+ parts

$0.261

100+ parts

-

1k+ parts

-

10k+ parts

$0.256

3,738

$0.261

-

-

$0.256

Argo Parts USA

USA . 2,020 parts In-Stock

1+ parts

$0.261

100+ parts

-

1k+ parts

-

10k+ parts

$0.253

2,020

$0.261

-

-

$0.253

Corphita

USA . 1,944 parts In-Stock

1+ parts

$0.263

100+ parts

-

1k+ parts

-

10k+ parts

-

1,944

$0.263

-

-

-

Ampacity Inc.

Singapore . 870 parts In-Stock

1+ parts

$0.540

100+ parts

-

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-

10k+ parts

-

870

$0.540

-

-

-

AZTECH Wire

Italy . 715 parts In-Stock

1+ parts

$9.091

100+ parts

-

1k+ parts

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10k+ parts

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715

$9.091

-

-

-

Parana Technologies

USA . 1,885 parts In-Stock

1+ parts

$9.959

100+ parts

-

1k+ parts

$10.524

10k+ parts

-

1,885

$9.959

-

$10.524

-

DigiPath Technology Company

USA . 675 parts In-Stock

1+ parts

$10.966

100+ parts

$10.089

1k+ parts

-

10k+ parts

-

675

$10.966

$10.089

-

-

ChromeModa Solutions

Germany . 6,889 parts In-Stock

1+ parts

$11.190

100+ parts

$9.176

1k+ parts

-

10k+ parts

-

6,889

$11.190

$9.176

-

-

IDEA Electronic Components Group

UK . 479 parts In-Stock

1+ parts

$11.190

100+ parts

$10.630

1k+ parts

$10.071

10k+ parts

-

479

$11.190

$10.630

$10.071

-

Corohmni

South Africa . 40 parts In-Stock

1+ parts

$20.401

100+ parts

-

1k+ parts

-

10k+ parts

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40

$20.401

-

-

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Perfect Parts

USA . 935 parts In-Stock

1+ parts

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1k+ parts

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935

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$0.256

1k+ parts

$0.248

10k+ parts

$0.243

50

-

$0.256

$0.248

$0.243

Overview

Upgrade your electronic designs with the SN74CBT3257PWG4 from Texas Instruments, a leading manufacturer known for its high-quality components. This versatile multiplexer & demultiplexer offers customers a reliable solution for their circuit design needs, with a wide range of applications in various industries. With quick propagation delay, true output polarity, and industrial-grade temperature stability, this product provides exceptional value and performance. Trust Texas Instruments to deliver innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides a durable and cost-effective solution for the product.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards.

No. of Functions:

4 - Provides versatility and flexibility for various applications.

Package Shape:

RECTANGULAR - Offers a compact design for space-saving installations.

Nominal Supply Voltage / Vsup (V):

5 - Ensures compatibility with standard voltage levels.

Power Supplies (V):

5 - Provides a stable power source for consistent performance.

No. of Terminals:

16 - Allows for multiple connections and options for integration.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Offers an innovative design for enhanced performance.

Propagation Delay (tpd):

0.35 ns - Provides fast signal processing for efficient operation.

Maximum Operating Temperature:

85 °C - Ensures reliability even in high-temperature environments.

Output Characteristics:

3-STATE - Enables flexible control of output signals for diverse applications.

Minimum Operating Temperature:

40 °C - Ensures operational reliability in a wide range of environments.

Terminal Finish:

NICKEL PALLADIUM GOLD - Provides corrosion resistance and long-term reliability.

Terminal Position:

DUAL - Offers versatility in connecting the product to other components.

Maximum Seated Height:

1.2 mm - Provides a low-profile design for space-constrained installations.

Width:

4.4 mm - Compact size for efficient use of board space.

Output Polarity:

TRUE - Ensures accurate signal output for consistent performance.

Minimum Supply Voltage (Vsup):

4 V - Allows for operation at lower voltage levels for energy efficiency.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures reliability during soldering processes.

Peak Reflow Temperature °C:

260 - Can withstand high-temperature soldering without damage.

Length:

5 mm - Compact size for efficient use of board space.

Temperature Grade:

INDUSTRIAL - Suitable for use in a wide range of temperature environments.

Technology:

CMOS - Provides low power consumption and high-speed operation.

Terminal Form:

GULL WING - Offers a reliable connection to the circuit board.

Terminal Pitch:

0.65 mm - Provides a compact layout for efficient circuit design.

Maximum Supply Voltage (Vsup):

5.5 V - Ensures compatibility with a wide range of voltage sources.

No. of Outputs:

2 - Provides multiple output options for increased versatility.

Technical Specifications

Multiplexer & Demultiplexer SN74CBT3257PWG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE MUX/DMUX SWITCH

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74CBT3257PWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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