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CD54HC356H

Texas Instruments

CD54HC356H by Texas Instruments

CD54HC356H by Texas Instruments is an 8-input multiplexer with a propagation delay of 390 ns. It operates b/w -55 to 125 °C and supports a supply voltage range of 2-6 V. Ideal for military-grade applications, this CMOS technology chip features 3-STATE output characteristics in a surface-mount package style.

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1k+

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Vyrian

USA . 2,370 parts In-Stock

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Digiode

USA . 941 parts In-Stock

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Native Components

USA . 995 parts In-Stock

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$1.320

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Northwest PG Solutions

USA . 2,085 parts In-Stock

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Parana Technologies

USA . 2,098 parts In-Stock

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DigiPath Technology Company

USA . 2,089 parts In-Stock

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IDEA Electronic Components Group

UK . 482 parts In-Stock

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ChromeModa Solutions

Germany . 464 parts In-Stock

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AZTECH Wire

Italy . 364 parts In-Stock

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One Stop Electronics

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Corphita

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Overview

Discover the exceptional quality and precision of the CD54HC356H by Texas Instruments, a versatile Multiplexer & Demultiplexer device perfect for a wide range of applications. With 8 inputs and a nominal supply voltage of 4.5V, this surface mount chip offers unmatched reliability and performance. Whether you're designing military-grade equipment or seeking high-speed signal routing solutions, this product delivers. Trust in Texas Instruments for cutting-edge technology and superior functionality. Experience the value and benefits of the CD54HC356H for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving space and simplifying manufacturing processes.

No. of Inputs: 8

Having 8 inputs provides versatility and flexibility in connecting multiple input sources to the multiplexer/demultiplexer.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures stable and reliable operation within the specified voltage range.

No. of Terminals: 20

With 20 terminals, this product offers ample connectivity options for interfacing with other components in a circuit.

Package Style (Meter): UNCASED CHIP

The unencased chip package style allows for direct mounting on a PCB, enabling compact and efficient circuit design.

Propagation Delay (tpd): 390 ns

The low propagation delay of 390ns ensures fast signal processing and minimal delay in data transmission.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments and rugged conditions.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance state, enabling multiple devices to share the same output line without interference.

Minimum Operating Temperature: -55 °C

The wide operating temperature range of -55°C to 125°C makes this product suitable for use in extreme temperature conditions.

Terminal Position: UPPER

The upper terminal position simplifies PCB layout and facilitates easy connection to other components.

Output Polarity: COMPLEMENTARY

The complementary output polarity provides additional flexibility in circuit design and signal processing applications.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2V ensures compatibility with low voltage systems and energy-efficient operation.

Temperature Grade: MILITARY

The military-grade temperature rating indicates high reliability, durability, and performance in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital circuits.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and ensures reliable electrical connections during assembly.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6V provides a safety margin and ensures protection against overvoltage conditions.

Technical Specifications

Multiplexer & Demultiplexer CD54HC356H attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

TRANSPARENT ADDRESS LATCHES; REGISTERED DATA INPUTS

Family:

HC/UH

JESD-30 Code:

X-XUUC-N20

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Propagation Delay (tpd):

390 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

CD54HC356H Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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