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CD54HC157F96

Texas Instruments

CD54HC157F96 by Texas Instruments

CD54HC157F96 by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at supply voltages b/w 2V to 6V. With a propagation delay of 190ns and temperature range from -55°C to 125°C, it's ideal for military-grade applications requiring high-speed signal switching in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,105 parts In-Stock

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Digiode

USA . 1,217 parts In-Stock

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Native Components

USA . 799 parts In-Stock

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$1.030

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Northwest PG Solutions

USA . 2,302 parts In-Stock

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$1.133

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Parana Technologies

USA . 1,790 parts In-Stock

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$16.445

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$16.738

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AZTECH Wire

Italy . 252 parts In-Stock

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$16.968

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DigiPath Technology Company

USA . 2,302 parts In-Stock

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$18.107

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ChromeModa Solutions

Germany . 3,302 parts In-Stock

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$18.477

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$15.151

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IDEA Electronic Components Group

UK . 1,379 parts In-Stock

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$18.477

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$17.553

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$16.629

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One Stop Electronics

USA . 250 parts In-Stock

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$47.000

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Corphita

USA . 3,975 parts In-Stock

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Overview

Experience seamless and efficient data processing with the Texas Instruments CD54HC157F96 multiplexer & demultiplexer. Manufactured with precision using high-quality materials, this versatile component offers unmatched reliability and performance. Ideal for a wide range of applications, this product's innovative design ensures optimal functionality and ease of use. Invest in the CD54HC157F96 today and unlock a world of possibilities for your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package body materials provide high reliability and durability, making this product suitable for rugged environments.

No. of Functions: 4

Having 4 functions in one device allows for efficient multiplexing and demultiplexing of signals, reducing the need for multiple separate components.

No. of Inputs: 2

With 2 inputs, this multiplexer/demultiplexer offers flexibility in signal routing and selection, accommodating various input sources.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration and mounting on circuit boards or systems, optimizing space utilization.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V provides a balanced performance in terms of power consumption and signal processing capabilities.

Propagation Delay (tpd): 190 ns

Fast propagation delay of 190 ns ensures quick signal processing and minimal latency, ideal for applications requiring real-time data handling.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C allows for reliable operation in elevated temperature environments without performance degradation.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C ensures functionality in extreme cold conditions, expanding the product's usability range.

Terminal Position: DUAL

Dual terminal position enhances connectivity options and simplifies installation or connection processes, making integration easier.

Output Polarity: TRUE

True output polarity ensures accurate signal representation and compatibility with downstream components or systems, reducing errors in signal processing.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage of 2V enables operation in low-power scenarios or battery-operated devices, enhancing versatility and energy efficiency.

Temperature Grade: MILITARY

Military-grade temperature rating indicates robustness and reliability under harsh environmental conditions, making this product suitable for mission-critical applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, ensuring reliable and efficient signal processing.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies PCB assembly and soldering processes, providing secure and stable connections for long-term usage.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage of 6V allows for flexibility in power supply options and compatibility with a wide range of operating conditions.

Technical Specifications

Multiplexer & Demultiplexer CD54HC157F96 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-GDIP-T16

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

CD54HC157F96 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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