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SNC54HC253J

Texas Instruments

SNC54HC253J by Texas Instruments

SNC54HC253J by Texas Instruments is a CMOS multiplexer/demultiplexer with 2 functions, 4 inputs, and 3-STATE output characteristics. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military applications requiring MIL-STD-883 Class B screening. The package style is IN-LINE with a ceramic body material and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,967 parts In-Stock

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Digiode

USA . 2,867 parts In-Stock

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AZTECH Wire

Italy . 750 parts In-Stock

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$13.096

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Parana Technologies

USA . 955 parts In-Stock

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$13.159

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$13.665

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DigiPath Technology Company

USA . 222 parts In-Stock

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$14.489

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$13.330

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IDEA Electronic Components Group

UK . 2,082 parts In-Stock

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$14.785

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$14.046

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$13.306

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ChromeModa Solutions

Germany . 1,432 parts In-Stock

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$14.785

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$12.124

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One Stop Electronics

USA . 127 parts In-Stock

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$49.000

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Corphita

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Overview

Upgrade your electronics with the SNC54HC253J multiplexer & demultiplexer from Texas Instruments, a trusted manufacturer known for high-quality products. This versatile component offers 2 functions, 4 inputs, and operates in a wide temperature range. Ideal for military-grade applications, this ceramic-packaged device ensures reliability and performance. Experience the value and benefits of Texas Instruments technology with the SNC54HC253J, providing seamless operation and peace of mind for your projects. Trust in Texas Instruments for superior quality and innovation in every product.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and high durability, making the product suitable for harsh environments.

No. of Functions: 2

Having 2 functions in a single device helps save space and reduce the overall complexity of the system.

Screening Level: MIL-STD-883 Class B (Modified)

Compliance with MIL-STD-883 Class B ensures high reliability and quality standards for military and aerospace applications.

No. of Inputs: 4

4 inputs provide flexibility in selecting and processing multiple input signals efficiently.

Package Shape: RECTANGULAR

Rectangular shape offers convenient integration and placement within a circuit or system.

Power Supplies (V): 2/6

Support for dual power supplies at 2V and 6V enables versatile compatibility with different system requirements.

No. of Terminals: 16

16 terminals allow for easy connectivity and interfacing with other components in the system.

Output Characteristics: 3-STATE

3-state output capability provides the ability to drive multiple loads efficiently and handle bus arbitration.

Minimum Operating Temperature: -55 °C

Wide operating temperature range enables reliable performance in extreme cold conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide sturdy mechanical connections and ease of soldering during assembly.

Terminal Pitch: 2.54 mm

Standardized terminal pitch allows for easy integration with common prototyping and circuit board layouts.

Technical Specifications

Multiplexer & Demultiplexer SNC54HC253J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54HC253J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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