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SN74CBTLV3257RGYR

Texas Instruments

SN74CBTLV3257RGYR by Texas Instruments

SN74CBTLV3257RGYR by Texas Instruments is a 4-bit multiplexer with 0.15 ns propagation delay, suitable for industrial applications. It operates at 2.5/3.3 V power supplies, has 16 terminals, and features a 3-STATE output characteristic. With a compact size of 4x3.5 mm and low power consumption of 0.01 mA, it is ideal for bidirectional signal routing in electronic systems.

Median Price

$0.344

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1,814 parts In-Stock

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$0.281

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$0.218

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$0.205

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Texas Instruments

USA . 13,192 parts In-Stock

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$0.165

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Mouser Electronics

USA . 5,393 parts In-Stock

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$0.720

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$0.404

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$0.355

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$0.321

5,393

$0.720

$0.404

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$0.321

DigiKey

USA . 2,730 parts In-Stock

1+ parts

$0.720

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$0.404

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$0.355

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$0.317

2,730

$0.720

$0.404

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$0.317

Chip1Stop

Japan . 2,074 parts In-Stock

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-

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$0.256

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$0.207

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Verical

USA . 1,814 parts In-Stock

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$0.218

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$0.272

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300

$0.272

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Digiode

USA . 703 parts In-Stock

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$0.313

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$0.313

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TEDSS.com

USA . 360 parts In-Stock

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$0.500

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$0.390

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$0.390

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Chip Stock

USA . 52,477 parts In-Stock

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Vyrian

USA . 13,721 parts In-Stock

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Component Sense

UK . 11,459 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,158 parts In-Stock

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Sunrise Surplus Inc.

USA . 1,953 parts In-Stock

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Bristol Electronics

USA . 1,834 parts In-Stock

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SPM Sales

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446

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Cyclops Electronics Ltd

UK . 410 parts In-Stock

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Quantum Digital Technology

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Prism Electronics

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Microfarads

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Distributors (Availability)

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Semicontronic

India . 14,049 parts In-Stock

1+ parts

$0.185

100+ parts

$0.180

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$0.179

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14,049

$0.185

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$0.179

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Ampacity Inc.

Singapore . 13,878 parts In-Stock

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$0.185

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Bastille Electronics

Australia . 100 parts In-Stock

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$0.272

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$0.258

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$0.245

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$0.242

100

$0.272

$0.258

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$0.242

Argo Parts USA

USA . 4,558 parts In-Stock

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$0.272

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$0.264

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Continental Prestige Electronics

USA . 1,932 parts In-Stock

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$0.272

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$0.267

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Corphita

USA . 2,246 parts In-Stock

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$0.296

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Corohmni

South Africa . 1,005 parts In-Stock

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$25.158

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Parana Technologies

USA . 125 parts In-Stock

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$28.747

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$51.333

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$28.747

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$30.125

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$27.414

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$24.702

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DigiPath Technology Company

USA . 1,566 parts In-Stock

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$31.654

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$29.122

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ChromeModa Solutions

Germany . 4,461 parts In-Stock

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$32.300

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$26.486

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IDEA Electronic Components Group

UK . 2,138 parts In-Stock

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$32.300

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$30.685

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$29.070

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Perfect Parts

USA . 25,796 parts In-Stock

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GreenTree Electronics

Israel . 24,000 parts In-Stock

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S.R.D Solutions

India . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 14,423 parts In-Stock

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Futuretech Components

Singapore . 12,000 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 9,600 parts In-Stock

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Kepictronics

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Infinite Electronics LLP (Excess)

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Formix International (Excess)

India . 969 parts In-Stock

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Overview

Discover the versatile SN74CBTLV3257RGYR by Texas Instruments, a top-quality multiplexer & demultiplexer that offers exceptional performance and reliability. With Texas Instruments' renowned reputation for excellence, this chip carrier delivers seamless functionality in a compact package, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this innovative solution ensures efficient signal routing and data transmission. Experience the value and benefits of enhanced connectivity with the SN74CBTLV3257RGYR, designed to meet your needs with precision and ease. Elevate your projects with Texas Instruments technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring easy handling and long-lasting performance.

Propagation Delay At Nominal Supply: 0.15 ns

The low propagation delay at nominal supply voltage ensures fast data processing and efficient operation of the multiplexer & demultiplexer.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 4

Having 4 functions in one device increases efficiency and saves on component count, making it a cost-effective choice for applications requiring multiple functions.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V ensures compatibility with various standard power supplies, making it versatile and easy to integrate into existing systems.

Load Capacitance (CL): 30 pF

The load capacitance of 30 pF ensures stable and reliable operation, suitable for handling different types of loads in the application.

Power Supplies (V): 2.5/3.3

Compatibility with both 2.5V and 3.3V power supplies provides flexibility in design and allows for integration in a wide range of systems.

Propagation Delay (tpd): 0.25 ns

The low propagation delay of 0.25 ns ensures fast signal processing, reducing latency and improving overall system performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability in harsh environments and extended use without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the device to operate in extreme temperature conditions, making it suitable for a variety of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term performance.

No. of Ports: 3

Having 3 ports allows for versatile connectivity options, facilitating the transfer of signals between multiple devices or systems.

Width: 3.5 mm

The compact width of 3.5 mm enables space-saving design and integration in applications with size constraints, making it a versatile and efficient choice.

Minimum Supply Voltage (Vsup): 2.3 V

The minimum supply voltage of 2.3V ensures compatibility with lower voltage systems while maintaining operational efficiency, making it suitable for a wide range of applications.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides flexibility in power supply options and ensures compatibility with higher voltage systems, making it a versatile choice for various applications.

Technology: CMOS

Using CMOS technology offers low power consumption, high noise immunity, and fast operation, making it an efficient and reliable choice for signal processing applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting, enabling the device to be used in compact designs and applications with limited space.

Technical Specifications

Multiplexer & Demultiplexer SN74CBTLV3257RGYR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBTLV/3B

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Load Capacitance (CL):

30 pF

Moisture Sensitivity Level (MSL):

2

No. of Bits:

4

No. of Functions:

4

No. of Inputs:

1

No. of Outputs:

2

No. of Ports:

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16/20,.14X.16,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

SN74CBTLV3257RGYR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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