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DM54AS157J/883B

Texas Instruments

DM54AS157J/883B by Texas Instruments

The Texas Instruments DM54AS157J/883B is a MILITARY-grade TTL Multiplexer with 4 functions, 2 inputs, and operates at -55 to 125 °C. It has a CERAMIC package body, DUAL terminals with Tin/Lead finish, and RECTANGULAR shape. Ideal for high-reliability applications requiring precise signal routing in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,645 parts In-Stock

1+ parts

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3,645

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Digiode

USA . 1,883 parts In-Stock

1+ parts

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1,883

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Anansix

USA . 1,619 parts In-Stock

1+ parts

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1,619

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 993 parts In-Stock

1+ parts

$0.034

100+ parts

-

1k+ parts

-

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$0.033

993

$0.034

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$0.033

AZTECH Wire

Italy . 734 parts In-Stock

1+ parts

$7.375

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734

$7.375

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Parana Technologies

USA . 479 parts In-Stock

1+ parts

$19.418

100+ parts

$1,803.258

1k+ parts

$17.476

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479

$19.418

$1,803.258

$17.476

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DigiPath Technology Company

USA . 663 parts In-Stock

1+ parts

$21.382

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663

$21.382

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ChromeModa Solutions

Germany . 2,006 parts In-Stock

1+ parts

$21.818

100+ parts

$17.891

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2,006

$21.818

$17.891

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IDEA Electronic Components Group

UK . 875 parts In-Stock

1+ parts

$21.818

100+ parts

$20.727

1k+ parts

$19.636

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875

$21.818

$20.727

$19.636

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One Stop Electronics

USA . 718 parts In-Stock

1+ parts

$55.000

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718

$55.000

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Corphita

USA . 3,922 parts In-Stock

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3,922

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Northwest PG Solutions

USA . 211 parts In-Stock

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211

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Overview

Unlock the power of seamless data transmission with the DM54AS157J/883B by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers top-notch quality and reliability. This multiplexer & demultiplexer offers unparalleled performance and versatility, making it ideal for a wide range of applications. Experience the value of precision engineering and innovative design with the DM54AS157J/883B, providing customers with unmatched benefits and advantages in their projects. Trust Texas Instruments to elevate your technology to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material is known for its thermal properties, making it suitable for high temperature environments. This ensures the reliability and durability of the product.

No. of Functions: 4

Having multiple functions in a single device increases efficiency and saves space in a circuit design.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure reliable performance in harsh operating conditions, making it suitable for military-grade applications.

No. of Inputs: 2

Having multiple inputs allows for versatile input configurations, increasing the flexibility of the device in various applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a common standard in many electronic systems, ensuring compatibility and ease of integration.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the device to function reliably even in extreme temperature conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and conductivity, ensuring secure connections in the circuit.

Technology: TTL

TTL technology is known for its high-speed operation and low power consumption, making it a preferred choice for many applications.

Technical Specifications

Multiplexer & Demultiplexer DM54AS157J/883B attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

DM54AS157J/883B Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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