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DM54S258J/883B

Texas Instruments

DM54S258J/883B by Texas Instruments

DM54S258J/883B by Texas Instruments is a 4-function multiplexer with 2 inputs, 16 terminals, and a propagation delay of 9ns. It operates in temperatures ranging from -55°C to 125°C and is designed for military-grade applications requiring TTL technology and inverted output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,202 parts In-Stock

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Digiode

USA . 5,066 parts In-Stock

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Anansix

USA . 1,284 parts In-Stock

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Northwest PG Solutions

USA . 1,198 parts In-Stock

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$3.226

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AZTECH Wire

Italy . 560 parts In-Stock

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Parana Technologies

USA . 1,772 parts In-Stock

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$28.395

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DigiPath Technology Company

USA . 283 parts In-Stock

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$31.266

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ChromeModa Solutions

Germany . 6,747 parts In-Stock

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$31.904

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$26.161

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IDEA Electronic Components Group

UK . 873 parts In-Stock

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One Stop Electronics

USA . 1,506 parts In-Stock

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Native Components

USA . 807 parts In-Stock

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Corphita

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Overview

Experience unparalleled quality with the DM54S258J/883B by Texas Instruments, a leading manufacturer in the industry. This versatile multiplexer & demultiplexer offers exceptional value with its reliable performance and innovative design. Ideal for a wide range of applications, this product provides customers with unmatched benefits such as fast propagation delay, high temperature tolerance, and multiple functions in a compact package. Trust Texas Instruments to deliver top-notch solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material ensures durability and protection for the internal components of the multiplexer/demultiplexer.

No. of Functions: 4

With 4 functions available, this product offers versatility and flexibility in routing signals efficiently.

Screening Level: MIL-STD-883 Class B

Meeting MIL-STD-883 Class B standards ensures high reliability and quality assurance for critical applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage provides stable power to the multiplexer/demultiplexer for consistent performance.

Propagation Delay (tpd): 9 ns

With a propagation delay of 9 ns, this product offers fast switching speeds for efficient signal processing.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for high impedance states, enabling multiple devices to share the same output line without interference.

Technology: TTL

TTL technology ensures compatibility with other TTL components, making integration into existing systems seamless.

Technical Specifications

Multiplexer & Demultiplexer DM54S258J/883B attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

9 ns

Screening Level:

MIL-STD-883 Class B

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

DM54S258J/883B Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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