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DM54LS257W

Texas Instruments

DM54LS257W by Texas Instruments

DM54LS257W by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 21ns at 5V. It operates in a temperature range of -55 to 125°C and has a max power supply current of 17mA. This TTL technology device is ideal for military-grade applications requiring high-speed signal switching.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,059 parts In-Stock

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4,059

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Anansix

USA . 2,406 parts In-Stock

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2,406

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Digiode

USA . 675 parts In-Stock

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675

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Sunrise Surplus Inc.

USA . 34 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 56 parts In-Stock

1+ parts

$0.390

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$0.375

56

$0.390

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$0.375

Northwest PG Solutions

USA . 602 parts In-Stock

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$0.429

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$0.379

602

$0.429

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$0.379

Parana Technologies

USA . 832 parts In-Stock

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$17.027

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$17.252

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832

$17.027

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$17.252

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AZTECH Wire

Italy . 658 parts In-Stock

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$17.898

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658

$17.898

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DigiPath Technology Company

USA . 1,679 parts In-Stock

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$18.749

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1,679

$18.749

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ChromeModa Solutions

Germany . 1,403 parts In-Stock

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$19.132

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$15.688

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1,403

$19.132

$15.688

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IDEA Electronic Components Group

UK . 113 parts In-Stock

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$19.132

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$18.175

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$17.219

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113

$19.132

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One Stop Electronics

USA . 555 parts In-Stock

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$56.000

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Corphita

USA . 4,056 parts In-Stock

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4,056

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the DM54LS257W multiplexer & demultiplexer. This versatile component offers 4 functions in a compact flatpack package, making it ideal for a wide range of applications. With a fast propagation delay of just 21 ns and 3-state output characteristics, this product guarantees optimal performance. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs with precision and efficiency. Choose the DM54LS257W for superior value and seamless integration into your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic material provides excellent thermal conductivity and stability, ensuring reliable performance even in high temperature environments.

Propagation Delay At Nominal Supply: 21 ns

Low propagation delay ensures fast processing of signals, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB mounting, saving space and enabling automated assembly processes.

No. of Functions: 4

Having 4 functions in one device provides versatility and flexibility in signal routing and processing applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a commonly used 5V supply voltage makes integration with existing systems convenient and straightforward.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, ensuring durability, reliability, and performance in harsh environments and critical applications.

Technology: TTL

Utilizing TTL technology provides compatibility with a wide range of digital systems and ensures reliable signal processing.

Technical Specifications

Multiplexer & Demultiplexer DM54LS257W attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-XDFP-F16

JESD-609 Code:

e0

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

17 mA

Propagation Delay At Nominal Supply:

21 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

DM54LS257W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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