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SN74AS253FN3

Texas Instruments

SN74AS253FN3 by Texas Instruments

SN74AS253FN3 by Texas Instruments is a TTL technology chip carrier with 2 functions, 4 inputs, and 20 terminals. It has a propagation delay of 14 ns and operates b/w 0-70°C. Ideal for applications requiring multiplexing/demultiplexing in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,193 parts In-Stock

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4,193

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Vyrian

USA . 3,782 parts In-Stock

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3,782

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Distributors (Availability)

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One Stop Electronics

USA . 1,116 parts In-Stock

1+ parts

$11.000

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1,116

$11.000

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Parana Technologies

USA . 287 parts In-Stock

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$15.135

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$15.542

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287

$15.135

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$15.542

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DigiPath Technology Company

USA . 989 parts In-Stock

1+ parts

$16.666

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989

$16.666

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ChromeModa Solutions

Germany . 3,697 parts In-Stock

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$17.006

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$13.945

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3,697

$17.006

$13.945

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IDEA Electronic Components Group

UK . 17 parts In-Stock

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$17.006

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$16.156

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$15.305

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17

$17.006

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$15.305

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AZTECH Wire

Italy . 766 parts In-Stock

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$17.058

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766

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Corphita

USA . 3,027 parts In-Stock

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Overview

Upgrade your electronic projects with the SN74AS253FN3 multiplexer by Texas Instruments. With a reputation for quality and reliability, Texas Instruments delivers cutting-edge technology in a compact chip carrier package. This versatile device features 2 functions, 4 inputs, and a fast propagation delay of just 14 ns. Perfect for applications in communication systems, industrial controls, and data processing, this multiplexer offers superior performance and efficiency. Trust Texas Instruments to provide value, benefits, and advantages that exceed your expectations. Elevate your designs with the SN74AS253FN3 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 14 ns

Low propagation delay ensures fast and efficient signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, leading to cost savings and simplifying circuit design.

No. of Inputs: 4

With 4 inputs, this multiplexer/demultiplexer can handle multiple input signals, making it versatile and suitable for various applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board and enables easy alignment during mounting.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options, allowing for flexibility in circuit design and functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and lightweight, ideal for applications where space is limited and weight is a concern.

Maximum I (ol): 24 Amp

High maximum output current allows the product to handle heavy loads without overheating or malfunctioning, ensuring reliability in operation.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can perform reliably in a wide range of environmental conditions.

Output Characteristics: 3-STATE

3-STATE output allows for the multiplexer/demultiplexer to be in one of three distinct states, providing flexibility in signal routing and control.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures the product can function in cold environments without performance degradation.

Terminal Position: QUAD

Quad terminal position enables easy connection with other components and circuitry, simplifying installation and maintenance tasks.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the product is suitable for standard commercial applications, offering a balance between performance and cost.

Technology: TTL

TTL technology provides reliable and high-speed signal processing, making this product suitable for applications where timing and accuracy are critical.

Terminal Form: J BEND

J bend terminal form allows for easy soldering and secure connection to the circuit board, ensuring stable electrical contact and longevity.

Terminal Pitch: 1.27 mm

Small terminal pitch of 1.27 mm enables high-density mounting and compact PCB design, making this product ideal for space-constrained applications.

Maximum Power Supply Current (ICC): 14 mA

Low maximum power supply current requirements of 14 mA reduce power consumption and heat generation, making this product energy-efficient and cost-effective.

Technical Specifications

Multiplexer & Demultiplexer SN74AS253FN3 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

14 mA

Propagation Delay At Nominal Supply:

14 ns

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74AS253FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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