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MC100EL58DG

Onsemi

MC100EL58DG by Onsemi

MC100EL58DG by Onsemi is a 2-input multiplexer with 0.34 ns propagation delay at 5V. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package style. Ideal for high-speed applications requiring fast signal switching.

Median Price

$7.920

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 88 parts In-Stock

1+ parts

$7.920

100+ parts

$5.195

1k+ parts

$4.784

10k+ parts

$4.686

88

$7.920

$5.195

$4.784

$4.686

Mouser Electronics

USA . 37 parts In-Stock

1+ parts

$7.920

100+ parts

$5.010

1k+ parts

$4.710

10k+ parts

$4.540

37

$7.920

$5.010

$4.710

$4.540

Chip1Stop

Japan . 6 parts In-Stock

1+ parts

$15.100

100+ parts

-

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6

$15.100

-

-

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Rochester

USA . 5,233 parts In-Stock

1+ parts

-

100+ parts

$4.270

1k+ parts

$3.820

10k+ parts

$3.590

5,233

-

$4.270

$3.820

$3.590

Verical

USA . 3,834 parts In-Stock

1+ parts

-

100+ parts

$5.338

1k+ parts

$4.775

10k+ parts

$4.487

3,834

-

$5.338

$4.775

$4.487

Flip Electronics (Authorized)

USA . 1,470 parts In-Stock

1+ parts

-

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1,470

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,084 parts In-Stock

1+ parts

$4.494

100+ parts

-

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-

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-

1,084

$4.494

-

-

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Vyrian

USA . 2,223 parts In-Stock

1+ parts

-

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2,223

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Flip Electronics

USA . 1,470 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,470

-

-

-

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ACDS - Activité Composants Distribution Service

France . 53 parts In-Stock

1+ parts

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100+ parts

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53

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Nova Conductors

Japan . 41 parts In-Stock

1+ parts

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41

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Prism Electronics

USA . 17 parts In-Stock

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17

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,205 parts In-Stock

1+ parts

$4.020

100+ parts

-

1k+ parts

-

10k+ parts

-

2,205

$4.020

-

-

-

Semicontronic

India . 2,190 parts In-Stock

1+ parts

$4.020

100+ parts

$3.920

1k+ parts

$3.899

10k+ parts

-

2,190

$4.020

$3.920

$3.899

-

Corphita

USA . 182 parts In-Stock

1+ parts

$4.257

100+ parts

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182

$4.257

-

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Corohmni

South Africa . 385 parts In-Stock

1+ parts

$4.730

100+ parts

-

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10k+ parts

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385

$4.730

-

-

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Aztec Data Supply Inc.

USA . 3,309 parts In-Stock

1+ parts

$8.647

100+ parts

-

1k+ parts

-

10k+ parts

-

3,309

$8.647

-

-

-

Microchip USA

USA . 1,470 parts In-Stock

1+ parts

$18.000

100+ parts

$17.750

1k+ parts

$17.620

10k+ parts

$17.490

1,470

$18.000

$17.750

$17.620

$17.490

Kulean Microsystems

USA . 6,433 parts In-Stock

1+ parts

-

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6,433

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Argo Parts USA

USA . 4,526 parts In-Stock

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4,526

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Continental Prestige Electronics

USA . 3,205 parts In-Stock

1+ parts

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3,205

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SupplyDigital Components

Austria . 2,356 parts In-Stock

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2,356

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Perfect Parts

USA . 380 parts In-Stock

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380

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Problanco Electronics

Mexico . 331 parts In-Stock

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331

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TANS Electronics

Latvia . 240 parts In-Stock

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240

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Cyclops Electronics Ltd (Excess)

UK . 53 parts In-Stock

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53

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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UHIMA Technologies

Türkiye . 1 parts In-Stock

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-

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1

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Overview

Boost your electronics projects with the MC100EL58DG by Onsemi, a top-of-the-line multiplexer & demultiplexer that guarantees high-quality performance and reliability. With a wide range of applications, this product offers unparalleled value to customers seeking precision and efficiency in their designs. Trust in Onsemi's reputation for excellence in technology to deliver the advantages you need for your next project, from its compact package shape to its low propagation delay. Elevate your creations with the MC100EL58DG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 0.38 ns

Low propagation delay ensures fast signal processing, making the multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and facilitating automated manufacturing processes.

No. of Inputs: 2

Having 2 inputs allows for versatile signal routing options, increasing the flexibility of the multiplexer/demultiplexer.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard power sources, enhancing its usability in various applications.

Power Supplies (V): -4.5

Compatible with a wide range of power supplies, including negative voltage sources, making it adaptable to different system configurations.

No. of Terminals: 8

Having 8 terminals allows for easy connectivity with other components, enabling seamless integration into electronic systems.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments, making it suitable for use in a wide range of industrial applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the multiplexer/demultiplexer can withstand harsh operating conditions without performance degradation.

Terminal Finish: MATTE TIN

Matte Tin finish provides good solderability and corrosion resistance, ensuring reliable connections during assembly and operation.

Technical Specifications

Multiplexer & Demultiplexer MC100EL58DG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V

Family:

100EL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

19 mA

Propagation Delay At Nominal Supply:

.38 ns

Propagation Delay (tpd):

.34 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100EL58DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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