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MC100E163FNR2

Onsemi

MC100E163FNR2 by Onsemi

MC100E163FNR2 by Onsemi is a 2-function, 8-input multiplexer with 0.9 ns propagation delay. Operating b/w 0-85 °C, it has a supply voltage range of 4.2-5.7V and ICC of 100mA. Ideal for high-speed data communication systems requiring fast signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 216 parts In-Stock

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Vyrian

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Kulean Microsystems

USA . 5,895 parts In-Stock

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TANS Electronics

Latvia . 2,493 parts In-Stock

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Problanco Electronics

Mexico . 2,399 parts In-Stock

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SupplyDigital Components

Austria . 2,003 parts In-Stock

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Corphita

USA . 540 parts In-Stock

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Microchip USA

USA . 329 parts In-Stock

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Corohmni

South Africa . 292 parts In-Stock

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UHIMA Technologies

Türkiye . 192 parts In-Stock

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Overview

Enhance your electronic designs with the MC100E163FNR2 by Onsemi, a cutting-edge multiplexer & demultiplexer device that offers unmatched quality and performance. Manufactured by Onsemi, a trusted name in the industry, this product boasts a fast propagation delay of just 0.8 ns, making it ideal for high-speed applications. With 8 inputs and 2 functions, this chip carrier package provides incredible versatility and reliability. Say goodbye to slow response times and hello to seamless operation with the MC100E163FNR2. Unlock the full potential of your projects and experience the benefits of using top-tier components from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the multiplexer & demultiplexer.

Propagation Delay At Nominal Supply: 0.8 ns

The low propagation delay ensures fast processing and response times, making this product suitable for high-speed data transmission.

No. of Functions: 2

With two functions in one device, this multiplexer & demultiplexer offers versatility and efficiency in data routing and control.

Nominal Supply Voltage / Vsup (V): 5

The standard 5V supply voltage ensures compatibility with common power sources, making it easy to integrate this product into existing systems.

Minimum Operating Temperature: 0 °C

The wide operating temperature range of 0 to 85 °C allows this multiplexer & demultiplexer to be used in various environmental conditions.

Technology: ECL

The ECL technology used in this product offers high-speed operation and low power consumption, making it ideal for demanding applications where performance is critical.

Technical Specifications

Multiplexer & Demultiplexer MC100E163FNR2 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

.8 ns

Propagation Delay (tpd):

.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E163FNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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