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MC100E157FNG

Onsemi

MC100E157FNG by Onsemi

MC100E157FNG by Onsemi is a 4:2 multiplexer with 0.55 ns propagation delay at 5V. It operates in the temperature range of 0-85 °C and has a terminal pitch of 1.27mm. Ideal for high-speed data communication systems requiring fast signal switching.

Median Price

$7.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$7.950

1k+ parts

-

10k+ parts

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150

-

$7.950

-

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Rochester

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$6.870

1k+ parts

$6.150

10k+ parts

$5.780

50

-

$6.870

$6.150

$5.780

Verical

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$8.588

1k+ parts

$7.688

10k+ parts

$7.225

50

-

$8.588

$7.688

$7.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 185 parts In-Stock

1+ parts

$7.258

100+ parts

-

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185

$7.258

-

-

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Vyrian

USA . 5,421 parts In-Stock

1+ parts

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5,421

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ComSIT Distribution GmbH

Germany . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 399 parts In-Stock

1+ parts

$6.300

100+ parts

-

1k+ parts

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399

$6.300

-

-

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Corphita

USA . 1,424 parts In-Stock

1+ parts

$6.876

100+ parts

-

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1,424

$6.876

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SupplyDigital Components

Austria . 8,182 parts In-Stock

1+ parts

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8,182

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Kulean Microsystems

USA . 6,360 parts In-Stock

1+ parts

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6,360

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Problanco Electronics

Mexico . 4,747 parts In-Stock

1+ parts

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4,747

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TANS Electronics

Latvia . 3,971 parts In-Stock

1+ parts

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3,971

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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UHIMA Technologies

Türkiye . 660 parts In-Stock

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660

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Microchip USA

USA . 336 parts In-Stock

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336

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Continental Prestige Electronics

USA . 150 parts In-Stock

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150

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Overview

Unleash the power of seamless data transmission with the MC100E157FNG Multiplexer & Demultiplexer by Onsemi. Crafted with precision and expertise, this innovative product offers unmatched reliability and efficiency in managing multiple functions and inputs with a propagation delay of just 0.55 ns. Ideal for a wide range of applications, this chip carrier package ensures optimal performance even in extreme temperatures. Elevate your projects with the quality and value that only Onsemi can provide, setting new standards in connectivity and functionality. Experience the difference with the MC100E157FNG - where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Functions: 4

Allows for multiple functions to be controlled or multiplexed with a single device, increasing efficiency and reducing the need for additional components.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with most systems and devices.

Technology: ECL

Emitter-coupled logic technology offers high speed and low power consumption, making it ideal for high-performance applications.

Propagation Delay (tpd): 0.55 ns

Low propagation delay ensures fast signal processing and minimal lag in data transmission.

Technical Specifications

Multiplexer & Demultiplexer MC100E157FNG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

44 mA

Propagation Delay At Nominal Supply:

.55 ns

Propagation Delay (tpd):

.55 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E157FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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