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MC100E164FN

Onsemi

MC100E164FN by Onsemi

MC100E164FN by Onsemi is a 16-input ECL multiplexer with 0.85 ns propagation delay at 5V. It operates b/w 0-85 °C, has a terminal pitch of 1.27mm, and is ideal for high-speed data communication applications.

Median Price

$9.230

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 6 parts In-Stock

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$9.230

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$6.920

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$6.000

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$9.230

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$6.000

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Vyrian

USA . 2,143 parts In-Stock

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Digiode

USA . 1,047 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 906 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 328 parts In-Stock

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PC Components Company LLC

USA . 123 parts In-Stock

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

France . 37 parts In-Stock

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Electronics Depot

USA . 37 parts In-Stock

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A2Z Electronics, Inc.

USA . 32 parts In-Stock

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Ashlea Components Ltd

UK . 24 parts In-Stock

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R&J Components

USA . 9 parts In-Stock

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Q Components

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Electronic Expediters

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Prism Electronics

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Distributors (Availability)

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Corohmni

South Africa . 229 parts In-Stock

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TANS Electronics

Latvia . 5,758 parts In-Stock

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Problanco Electronics

Mexico . 2,844 parts In-Stock

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Kulean Microsystems

USA . 1,415 parts In-Stock

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Corphita

USA . 1,326 parts In-Stock

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SupplyDigital Components

Austria . 1,289 parts In-Stock

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UHIMA Technologies

Türkiye . 685 parts In-Stock

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Microchip USA

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Assy Fe

Spain . 9 parts In-Stock

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Perfect Parts

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Overview

Discover the MC100E164FN by Onsemi, a high-quality multiplexer & demultiplexer that offers unparalleled performance and reliability. With a package body material of plastic/epoxy and a nominal supply voltage of 5V, this chip carrier is perfect for a wide range of applications. From telecommunications to networking, this versatile component excels in any scenario. Trust in Onsemi's expertise and innovation to deliver a product that not only meets but exceeds your expectations. Upgrade your systems today with the MC100E164FN and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ensures durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 0.85 ns

Provides fast signal processing and reduces latency in data transmission.

No. of Inputs: 16

Allows for a high level of input connectivity, making it suitable for complex data handling tasks.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power sources, making it easy to integrate into existing systems.

Output Characteristics: OPEN-EMITTER

Provides flexibility in signal output options for different system configurations.

Technical Specifications

Multiplexer & Demultiplexer MC100E164FN attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

16

No. of Outputs:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

81 mA

Propagation Delay At Nominal Supply:

.85 ns

Propagation Delay (tpd):

1.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E164FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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