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MC100E164FNR2G

Onsemi

MC100E164FNR2G by Onsemi

MC100E164FNR2G by Onsemi is a 16-input multiplexer with 0.85 ns propagation delay at 5V. It operates on ECL technology, has 28 terminals, and is surface mountable. Ideal for high-speed data switching applications in electronic circuits.

Median Price

$6.244

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 609 parts In-Stock

1+ parts

-

100+ parts

$5.550

1k+ parts

$4.960

10k+ parts

$4.670

609

-

$5.550

$4.960

$4.670

Verical

USA . 402 parts In-Stock

1+ parts

-

100+ parts

$6.938

1k+ parts

$6.200

10k+ parts

$5.838

402

-

$6.938

$6.200

$5.838

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,386 parts In-Stock

1+ parts

$5.871

100+ parts

-

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-

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-

2,386

$5.871

-

-

-

Vyrian

USA . 2,790 parts In-Stock

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2,790

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,433 parts In-Stock

1+ parts

$5.562

100+ parts

-

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-

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-

1,433

$5.562

-

-

-

Corohmni

South Africa . 411 parts In-Stock

1+ parts

$6.180

100+ parts

-

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-

411

$6.180

-

-

-

AZTECH Wire

Italy . 302 parts In-Stock

1+ parts

$21.220

100+ parts

-

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-

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-

302

$21.220

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$34.972

100+ parts

$31.825

1k+ parts

$28.677

10k+ parts

-

3,000

$34.972

$31.825

$28.677

-

Problanco Electronics

Mexico . 8,163 parts In-Stock

1+ parts

-

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8,163

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SupplyDigital Components

Austria . 8,125 parts In-Stock

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8,125

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TANS Electronics

Latvia . 4,326 parts In-Stock

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4,326

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Continental Prestige Electronics

USA . 609 parts In-Stock

1+ parts

-

100+ parts

$5.350

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609

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$5.350

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Microchip USA

USA . 329 parts In-Stock

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329

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UHIMA Technologies

Türkiye . 303 parts In-Stock

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303

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Kulean Microsystems

USA . 52 parts In-Stock

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Overview

Enhance your electronic designs with the MC100E164FNR2G by Onsemi. This high-quality multiplexer & demultiplexer offers unparalleled performance and reliability, thanks to Onsemi's reputation for excellence in manufacturing. With 16 inputs and a lightning-fast propagation delay of just 0.85 ns, this chip carrier device is perfect for a wide range of applications in the electronics industry. Experience the value and benefits of using the MC100E164FNR2G - unlock new possibilities for your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer/demultiplexer.

No. of Inputs: 16

Allows for the simultaneous processing and selection of 16 input signals, increasing the versatility of the device.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with a wide range of electronic systems.

Minimum Operating Temperature: 0 °C

Can operate in temperatures as low as 0 °C, making it suitable for various environmental conditions.

Technology: ECL

Uses Emitter-Coupled Logic technology for high-speed and low-power operation, ideal for applications requiring fast data processing.

Technical Specifications

Multiplexer & Demultiplexer MC100E164FNR2G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inputs:

16

No. of Outputs:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

81 mA

Propagation Delay At Nominal Supply:

.85 ns

Propagation Delay (tpd):

1.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E164FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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