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SN74CB3Q3257RGYR

Texas Instruments

SN74CB3Q3257RGYR by Texas Instruments

SN74CB3Q3257RGYR by Texas Instruments is a 4-function multiplexer with 0.12 ns propagation delay at 2.5V, suitable for industrial applications. It features 3-STATE output characteristics, operates b/w -40 to 85 °C, and has a compact chip carrier package style measuring 4mm x 3.5mm.

Median Price

$0.692

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,161 parts In-Stock

1+ parts

$0.598

100+ parts

$0.432

1k+ parts

$0.403

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1,161

$0.598

$0.432

$0.403

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Texas Instruments

USA . 62,199 parts In-Stock

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$0.712

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$0.484

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$0.248

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62,199

$0.712

$0.484

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DigiKey

USA . 1,837 parts In-Stock

1+ parts

$0.880

100+ parts

$0.496

1k+ parts

$0.442

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$0.387

1,837

$0.880

$0.496

$0.442

$0.387

Chip1Stop

Japan . 2,163 parts In-Stock

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-

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$0.692

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$0.391

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2,163

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$0.692

$0.391

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Verical

USA . 1,161 parts In-Stock

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$0.432

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$0.403

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$0.432

$0.403

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$0.642

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50

$0.642

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Digiode

USA . 3,771 parts In-Stock

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$0.676

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3,771

$0.676

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DF Sales Co.

USA . 6,390 parts In-Stock

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$1.000

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DF Sales Co.

USA . 6,390 parts In-Stock

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$1.000

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$1.000

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Chip Stock

USA . 27,500 parts In-Stock

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Vyrian

USA . 13,656 parts In-Stock

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Component Sense

UK . 9,905 parts In-Stock

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Lantek

USA . 1,079 parts In-Stock

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ComSIT Distribution GmbH

Germany . 734 parts In-Stock

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Beltway Electronics Company

USA . 385 parts In-Stock

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Bristol Electronics

USA . 205 parts In-Stock

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$0.422

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$0.422

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Atlantic Semiconductor

USA . 119 parts In-Stock

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Executive Electronics, Inc.

USA . 100 parts In-Stock

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100

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EMSNET

USA . 100 parts In-Stock

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100

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Semi Source

USA . 95 parts In-Stock

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95

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ACDS - Activité Composants Distribution Service

France . 89 parts In-Stock

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Dan-Mar Components

USA . 89 parts In-Stock

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Classic Components Corporation

USA . 33 parts In-Stock

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North Shore Components

USA . 5 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 13,365 parts In-Stock

1+ parts

$0.422

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$0.422

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Corphita

USA . 4,625 parts In-Stock

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$0.641

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$0.641

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Continental Prestige Electronics

USA . 6,523 parts In-Stock

1+ parts

$0.642

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$0.630

6,523

$0.642

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$0.630

Argo Parts USA

USA . 633 parts In-Stock

1+ parts

$0.642

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$0.623

633

$0.642

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$0.623

Parana Technologies

USA . 512 parts In-Stock

1+ parts

$14.460

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$14.902

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512

$14.460

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$14.902

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DigiPath Technology Company

USA . 1,900 parts In-Stock

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$15.922

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$14.648

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$15.922

$14.648

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ChromeModa Solutions

Germany . 3,059 parts In-Stock

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$16.247

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$13.323

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$16.247

$13.323

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IDEA Electronic Components Group

UK . 2,076 parts In-Stock

1+ parts

$16.247

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$15.435

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$14.622

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2,076

$16.247

$15.435

$14.622

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Corohmni

South Africa . 20 parts In-Stock

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$17.068

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Perfect Parts

USA . 28,771 parts In-Stock

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28,771

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Kepictronics

USA . 13,855 parts In-Stock

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A-Z Elektronik GmbH

Germany . 12,834 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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RoMaks

Hong Kong . 3,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Overview

Upgrade your electronic projects with the SN74CB3Q3257RGYR by Texas Instruments. Crafted with precision and expertise, this multiplexer & demultiplexer offers unparalleled performance and reliability. Whether you're a hobbyist or a professional, this versatile chip carrier is designed to meet your needs with a wide range of applications. With a very thin profile, low power consumption, and fast propagation delay, this high-quality component ensures seamless operation and efficiency. Trust Texas Instruments to deliver cutting-edge technology that elevates your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Propagation Delay At Nominal Supply: 0.12 ns

With a fast propagation delay, this multiplexer/demultiplexer ensures quick and efficient signal processing.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving design, making it convenient for integration into circuit boards.

No. of Functions: 4

This multiplexer/demultiplexer offers versatility with 4 functions in one component, saving on space and cost in complex systems.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V ensures compatibility with a wide range of systems and power sources.

Power Supplies (V): 2.5/3.3

With multiple power supply options, this product can easily adapt to different voltage requirements in various applications.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for input and output signals, allowing for flexibility in system configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offered cater to different design requirements and cooling needs, ensuring optimal performance in diverse environments.

Propagation Delay (tpd): 0.2 ns

The low propagation delay of 0.2 ns enables fast and precise signal transmission, crucial for high-speed data processing.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions without compromising performance.

Technical Specifications

Multiplexer & Demultiplexer SN74CB3Q3257RGYR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16/20,.14X.16,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.7 mA

Propagation Delay At Nominal Supply:

.12 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer/Demultiplexer

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

SN74CB3Q3257RGYR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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