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SN74S258FNR

Texas Instruments

SN74S258FNR by Texas Instruments

SN74S258FNR by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at a supply voltage of 5V. It features a propagation delay of 12ns and output characteristics in the form of 3-STATE. This chip carrier package is ideal for commercial applications requiring TTL technology and inverted output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,937 parts In-Stock

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4,937

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Digiode

USA . 4,540 parts In-Stock

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4,540

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Distributors (Availability)

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One Stop Electronics

USA . 1,206 parts In-Stock

1+ parts

$6.000

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1,206

$6.000

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Parana Technologies

USA . 650 parts In-Stock

1+ parts

$11.899

100+ parts

$1,105.030

1k+ parts

$10.709

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650

$11.899

$1,105.030

$10.709

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AZTECH Wire

Italy . 781 parts In-Stock

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$12.131

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781

$12.131

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DigiPath Technology Company

USA . 982 parts In-Stock

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$13.103

100+ parts

$12.054

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982

$13.103

$12.054

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IDEA Electronic Components Group

UK . 1,835 parts In-Stock

1+ parts

$13.370

100+ parts

$12.702

1k+ parts

$12.033

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1,835

$13.370

$12.702

$12.033

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ChromeModa Solutions

Germany . 1,417 parts In-Stock

1+ parts

$13.370

100+ parts

$10.963

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1,417

$13.370

$10.963

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Corphita

USA . 2,998 parts In-Stock

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Overview

Unlock the power of efficient data processing with the SN74S258FNR by Texas Instruments. With a reputation for high-quality manufacturing, this multiplexer & demultiplexer offers unmatched performance and reliability. Ideal for a variety of applications, this product boasts 4 functions, 2 inputs, and a nominal supply voltage of 5V. Experience fast propagation delay, 3-STATE output characteristics, and a wide operating temperature range. Elevate your projects with the value and benefits of Texas Instruments technology, setting new standards in data management and processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and durable, ensuring long-lasting performance.

Surface Mount: YES

Being surface mountable, the product is easy to install and saves space on the PCB.

No. of Functions: 4

With 4 functions in one device, it provides versatility and flexibility in multiplexing/demultiplexing tasks.

No. of Inputs: 2

Having 2 inputs allows for multiple input signals to be processed efficiently.

Package Shape: SQUARE

The square package shape provides stability and ease of mounting on the PCB.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V makes it compatible with standard power supplies.

Load Capacitance (CL): 15 pF

With a low load capacitance, the device ensures fast signal processing and minimal signal distortion.

No. of Terminals: 20

The 20 terminals offer ample connectivity options for various input and output configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides protection to the internal components and allows for easy handling during installation.

Propagation Delay (tpd): 12 ns

The low propagation delay ensures quick data transmission and minimal lag in signal processing.

Maximum Operating Temperature: 70 °C

Operating efficiently at high temperatures up to 70°C, making it suitable for various environmental conditions.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signals, enhancing the functionality of the product.

Minimum Operating Temperature: 0 °C

Able to operate at temperatures as low as 0°C, ensuring reliability even in cold environments.

Terminal Position: QUAD

The quad terminal position allows for easy connectivity and organization of input and output connections.

Maximum Seated Height: 4.57 mm

The low seated height of 4.57mm facilitates compact PCB design and installation in space-constrained applications.

Width: 8.9662 mm

The slim width of 8.9662mm saves space on the PCB and allows for efficient placement alongside other components.

Output Polarity: INVERTED

The inverted output polarity offers flexibility in signal processing and compatibility with different system requirements.

Minimum Supply Voltage (Vsup): 4.75 V

With a low minimum supply voltage of 4.75V, the product can operate efficiently even with slightly lower voltages.

Length: 8.9662 mm

The compact length of 8.9662mm offers a space-saving design and easy integration into different PCB layouts.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions found in commercial applications.

Technology: TTL

Utilizing TTL technology ensures compatibility with TTL logic levels and reliable signal processing in digital circuits.

Terminal Form: J BEND

The J bend terminal form facilitates easy and secure soldering on the PCB, ensuring reliable connections.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for dense packing and efficient use of space on the PCB.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage of 5.25V provides a safe operating range, protecting the device from voltage spikes and ensuring longevity.

Maximum Power Supply Current (ICC): 81 mA

With a maximum power supply current of 81mA, the device operates efficiently without drawing excessive power, making it energy-efficient.

Technical Specifications

Multiplexer & Demultiplexer SN74S258FNR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Power Supply Current (ICC):

81 mA

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

SN74S258FNR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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