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CD74HC151M96

Texas Instruments

CD74HC151M96 by Texas Instruments

CD74HC151M96 by Texas Instruments is an 8-input multiplexer with a propagation delay of 43ns. It operates at a supply voltage range of 2-6V and has a max power supply current of 0.16mA. This CMOS technology device is ideal for military-grade applications requiring high-speed data selection in compact designs.

Median Price

$0.364

Lifecycle Status

Suppliers In-Stock

18

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1k+

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Texas Instruments

USA . 155,797 parts In-Stock

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$0.364

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Mouser Electronics

USA . 4,108 parts In-Stock

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DigiKey

USA . 3,000 parts In-Stock

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Rochester

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Verical

USA . 2,500 parts In-Stock

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Digiode

USA . 3,019 parts In-Stock

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Nova Conductors

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Vyrian

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DigiKey Marketplace

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PC Components Company LLC

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Bristol Electronics

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GSS - Global Semi Support

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Technoshack Inc.

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Vectronix, Inc

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Corphita

USA . 1,539 parts In-Stock

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$0.158

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Aranea Global

USA . 500 parts In-Stock

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$0.207

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Microchip USA

USA . 5,355 parts In-Stock

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Parana Technologies

USA . 1,156 parts In-Stock

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DigiPath Technology Company

USA . 352 parts In-Stock

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IDEA Electronic Components Group

UK . 1,383 parts In-Stock

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ChromeModa Solutions

Germany . 1,102 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Glotronic Ltd.

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Metaverse IC Inc.

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Alle Elektronik GmbH

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Kepictronics

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Overview

Upgrade your electronic projects with the CD74HC151M96 by Texas Instruments, a top-quality multiplexer & demultiplexer that offers unmatched performance and reliability. With a wide range of applications in digital systems, this product provides customers with superior value and benefits including fast propagation delay, low power consumption, and excellent temperature tolerance. Trust in Texas Instruments' reputation for excellence and precision engineering to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product.

Propagation Delay At Nominal Supply: 43 ns

Low propagation delay ensures fast data transfer in the multiplexing and demultiplexing process.

Surface Mount: YES

Surface mount capability makes it easy to integrate into a variety of electronic devices.

No. of Inputs: 8

8 input channels provide flexibility in managing multiple input signals effectively.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal voltage of 4.5V makes it compatible with standard power supplies.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for use in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer CD74HC151M96 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

43 ns

Propagation Delay (tpd):

280 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74HC151M96 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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