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SNC54HC353FK

Texas Instruments

SNC54HC353FK by Texas Instruments

SNC54HC353FK by Texas Instruments is a CMOS multiplexer with 2 functions, 4 inputs, and 3-STATE output characteristics. It operates in temperatures ranging from -55 to 125°C and is ideal for military applications due to MIL-STD-883 Class B screening level. This chip carrier package has 20 terminals and is suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,663 parts In-Stock

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Vyrian

USA . 2,854 parts In-Stock

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2,854

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Distributors (Availability)

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AZTECH Wire

Italy . 490 parts In-Stock

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$15.528

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490

$15.528

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Parana Technologies

USA . 972 parts In-Stock

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$16.530

100+ parts

$1,535.058

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$14.877

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972

$16.530

$1,535.058

$14.877

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DigiPath Technology Company

USA . 597 parts In-Stock

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$18.202

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$16.745

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597

$18.202

$16.745

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ChromeModa Solutions

Germany . 3,715 parts In-Stock

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$18.573

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$15.230

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3,715

$18.573

$15.230

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IDEA Electronic Components Group

UK . 653 parts In-Stock

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$18.573

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$17.644

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$16.716

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653

$18.573

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$16.716

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One Stop Electronics

USA . 760 parts In-Stock

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$27.000

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Corphita

USA . 3,444 parts In-Stock

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Overview

Unleash the power of the SNC54HC353FK by Texas Instruments, a top-of-the-line multiplexer & demultiplexer that delivers unmatched quality and reliability. Manufactured by the trusted brand Texas Instruments, this versatile chip carrier offers 2 functions with 4 inputs, making it perfect for a wide range of military-grade applications. With a temperature range from -55 to 125°C, this ceramic package ensures optimal performance in any environment. Trust Texas Instruments to provide cutting-edge technology and superior products that exceed expectations. Elevate your projects with the SNC54HC353FK and experience the difference!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers high durability and thermal conductivity, making the product robust and suitable for high temperature environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during installation.

No. of Functions: 2

Provides versatility and flexibility in signal processing and routing, increasing the functionality of the product.

Screening Level: MIL-STD-883 Class B (Modified)

Ensures that the product meets stringent quality and reliability standards, making it suitable for critical applications.

No. of Inputs: 4

Allows for multiple input signals to be processed simultaneously, increasing the efficiency of the multiplexing/demultiplexing process.

Package Shape: SQUARE

Square shape provides a compact and space-saving design, ideal for applications where board space is limited.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures that the product can function in a wide range of environments without risk of overheating.

Output Characteristics: 3-STATE

3-state output allows for efficient signal routing and control, providing flexibility in managing output signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Temperature Grade: MILITARY

Military-grade temperature grade ensures the product can withstand extreme environmental conditions, making it suitable for rugged applications.

Technical Specifications

Multiplexer & Demultiplexer SNC54HC353FK attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNC54HC353FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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