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SN74HC352DW3

Texas Instruments

SN74HC352DW3 by Texas Instruments

SN74HC352DW3 by Texas Instruments is a CMOS dual multiplexer/demultiplexer with 2 functions and 4 inputs. It operates in industrial temperature range (-40 to 85°C) and has a small outline package style for surface mount applications. The device features 16 terminals with gull wing form, making it suitable for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,441 parts In-Stock

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2,441

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Digiode

USA . 2,001 parts In-Stock

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2,001

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Distributors (Availability)

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AZTECH Wire

Italy . 320 parts In-Stock

1+ parts

$7.607

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320

$7.607

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One Stop Electronics

USA . 215 parts In-Stock

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$10.000

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215

$10.000

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Parana Technologies

USA . 723 parts In-Stock

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$10.950

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$11.415

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723

$10.950

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$11.415

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DigiPath Technology Company

USA . 1,130 parts In-Stock

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$12.057

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1,130

$12.057

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ChromeModa Solutions

Germany . 2,373 parts In-Stock

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$12.303

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$10.088

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2,373

$12.303

$10.088

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IDEA Electronic Components Group

UK . 2,315 parts In-Stock

1+ parts

$12.303

100+ parts

$11.688

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$11.073

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2,315

$12.303

$11.688

$11.073

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Corphita

USA . 2,279 parts In-Stock

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2,279

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Overview

Elevate your electronic designs with the SN74HC352DW3 by Texas Instruments, a top-tier manufacturer known for producing high-quality multiplexers and demultiplexers. This versatile component boasts 2 functions, 4 inputs, and a compact 16-terminal package, making it ideal for a wide range of applications. With a temperature range of -40°C to 85°C and CMOS technology, this product delivers reliable performance in industrial environments. Give your projects a competitive edge with the value, benefits, and advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Surface Mount: YES

Surface mounting makes the installation process easier and more efficient, saving time and effort during assembly.

No. of Functions: 2

Having 2 functions in one device increases functionality and versatility, providing more options for signal processing.

No. of Inputs: 4

With 4 inputs, this multiplexer & demultiplexer can handle multiple signals simultaneously, making it suitable for complex systems.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and provides a compact design for space-constrained applications.

Power Supplies (V): 2/6

Supporting multiple power supply options (2V to 6V) gives flexibility in voltage requirements, accommodating a wider range of applications.

No. of Terminals: 16

Having 16 terminals allows for easy connectivity and signal routing, facilitating the integration of the device into larger systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and contributes to a more compact and efficient overall system design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product is suitable for industrial applications where temperature variations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold environments, making it versatile for various operating conditions.

Terminal Position: DUAL

Dual terminal position allows for optimal signal routing and connectivity, ensuring efficient signal transmission and reducing signal interference.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product meets the high standards for reliability and performance in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, reducing the risk of signal loss or disconnection during operation.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, the device allows for precise and reliable connections, ensuring optimal signal transmission and performance.

Technical Specifications

Multiplexer & Demultiplexer SN74HC352DW3 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/6

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC352DW3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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