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SN74LS357DW

Texas Instruments

SN74LS357DW by Texas Instruments

SN74LS357DW by Texas Instruments is an 8-input multiplexer with a propagation delay of 60 ns. Operating at a supply voltage range of 4.75V to 5.25V, it features open-collector outputs and is ideal for commercial temperature grade applications requiring TTL technology in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,525 parts In-Stock

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4,525

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Vyrian

USA . 2,816 parts In-Stock

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2,816

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Distributors (Availability)

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One Stop Electronics

USA . 1,021 parts In-Stock

1+ parts

$8.000

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1,021

$8.000

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AZTECH Wire

Italy . 420 parts In-Stock

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$16.562

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420

$16.562

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Parana Technologies

USA . 1,786 parts In-Stock

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$17.771

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$17.953

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1,786

$17.771

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$17.953

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DigiPath Technology Company

USA . 266 parts In-Stock

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$19.568

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$18.002

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266

$19.568

$18.002

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ChromeModa Solutions

Germany . 2,647 parts In-Stock

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$19.967

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$16.373

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2,647

$19.967

$16.373

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IDEA Electronic Components Group

UK . 203 parts In-Stock

1+ parts

$19.967

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$18.969

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$17.970

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203

$19.967

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$17.970

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Corphita

USA . 239 parts In-Stock

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Overview

Upgrade your electronic circuits with the SN74LS357DW by Texas Instruments, a high-quality multiplexer & demultiplexer that offers superior performance and reliability. Manufactured by industry leader Texas Instruments, this product is designed for a wide range of applications where precision and efficiency are crucial. With its advanced technology and innovative design, the SN74LS357DW provides customers with unmatched value, benefits, and advantages. Discover the difference that Texas Instruments can make in your projects with this exceptional component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the multiplexer/demultiplexer.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Inputs: 8

Having 8 inputs allows for versatile connection options, making the device suitable for various applications.

Propagation Delay (tpd): 60 ns

Low propagation delay ensures fast processing of signals, making the device efficient for time-sensitive operations.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for easy connection to other components or devices, enhancing flexibility in circuit design.

Technology: TTL

TTL technology ensures compatibility with a wide range of devices and systems, making the multiplexer/demultiplexer a versatile choice.

Technical Specifications

Multiplexer & Demultiplexer SN74LS357DW attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

46 mA

Propagation Delay (tpd):

60 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74LS357DW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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