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NB7VQ572MMNG

Onsemi

NB7VQ572MMNG by Onsemi

NB7VQ572MMNG by Onsemi is a 4-input multiplexer with a propagation delay of 20ns at 3.3V, suitable for industrial applications. It features a chip carrier package style, operates b/w -40 to 85°C, and has a terminal pitch of 0.5mm.

Median Price

$15.735

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 18 parts In-Stock

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$15.735

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Vyrian

USA . 5,104 parts In-Stock

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Digiode

USA . 1,670 parts In-Stock

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Microfarads

USA . 70 parts In-Stock

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Modulus Dynamics

Lithuania . 2,187 parts In-Stock

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$8.435

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$8.435

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$8.435

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2,187

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Ampacity Inc.

Singapore . 1,005 parts In-Stock

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$15.000

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AZTECH Wire

Italy . 728 parts In-Stock

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$15.258

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Microchip USA

USA . 1,538 parts In-Stock

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$52.831

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TANS Electronics

Latvia . 8,206 parts In-Stock

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Kulean Microsystems

USA . 4,166 parts In-Stock

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Argo Parts USA

USA . 3,030 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 2,984 parts In-Stock

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SupplyDigital Components

Austria . 2,464 parts In-Stock

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Corphita

USA . 2,199 parts In-Stock

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Continental Prestige Electronics

USA . 1,591 parts In-Stock

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Problanco Electronics

Mexico . 1,373 parts In-Stock

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Corohmni

South Africa . 178 parts In-Stock

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UHIMA Technologies

Türkiye . 56 parts In-Stock

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Overview

Upgrade your electronic systems with the NB7VQ572MMNG by Onsemi, a high-quality multiplexer & demultiplexer that offers reliable performance and precision. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a wide range of applications. With its fast propagation delay, surface mount capability, and low power consumption, the NB7VQ572MMNG provides exceptional value and benefits to customers seeking top-notch performance. Experience seamless integration and enhanced functionality with this innovative solution from Onsemi.

Feature Benefit Bullets

Propagation Delay At Nominal Supply

Low propagation delay ensures fast processing and minimal delay in signal transmission.

No. of Inputs

Allows for multiple input signals to be processed and transmitted efficiently.

Nominal Supply Voltage / Vsup (V)

Compatible with common supply voltages in electronics, making it versatile for different applications.

Minimum Operating Temperature

Capable of operating in low temperature environments, ensuring reliability in various conditions.

Terminal Pitch

Small terminal pitch allows for compact design and space-saving on circuit boards.

Temperature Grade

Suitable for industrial applications where reliability and durability are crucial.

Technical Specifications

Multiplexer & Demultiplexer NB7VQ572MMNG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

7V

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Propagation Delay At Nominal Supply:

20 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB7VQ572MMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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