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NB7V58MMNHTBG

Onsemi

NB7V58MMNHTBG by Onsemi

NB7V58MMNHTBG by Onsemi is a 2-input multiplexer with a propagation delay of 0.24 ns at 1.8V, suitable for industrial applications. It features a chip carrier package style with nickel gold palladium terminal finish and operates b/w -40 to 85 °C temperature range.

Median Price

$8.370

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,006 parts In-Stock

1+ parts

$8.370

100+ parts

$8.200

1k+ parts

$8.040

10k+ parts

-

1,006

$8.370

$8.200

$8.040

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,341 parts In-Stock

1+ parts

$7.952

100+ parts

-

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1,341

$7.952

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Vyrian

USA . 2,754 parts In-Stock

1+ parts

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2,754

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Chip Stock

USA . 235 parts In-Stock

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235

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,244 parts In-Stock

1+ parts

$7.533

100+ parts

-

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1,244

$7.533

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Corohmni

South Africa . 319 parts In-Stock

1+ parts

$8.370

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319

$8.370

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AZTECH Wire

Italy . 169 parts In-Stock

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$20.120

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169

$20.120

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$38.304

100+ parts

$34.857

1k+ parts

$31.409

10k+ parts

-

100

$38.304

$34.857

$31.409

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Microchip USA

USA . 1,117 parts In-Stock

1+ parts

$48.339

100+ parts

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1,117

$48.339

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TANS Electronics

Latvia . 7,421 parts In-Stock

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7,421

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Kulean Microsystems

USA . 6,649 parts In-Stock

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6,649

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Problanco Electronics

Mexico . 3,622 parts In-Stock

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3,622

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SupplyDigital Components

Austria . 1,501 parts In-Stock

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1,501

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UHIMA Technologies

Türkiye . 541 parts In-Stock

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541

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 214 parts In-Stock

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214

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Overview

Discover the cutting-edge NB7V58MMNHTBG by Onsemi, a top-tier manufacturer known for excellence in the multiplexer & demultiplexer category. This innovative product boasts a lightning-fast propagation delay of just 0.24 ns, making it ideal for high-speed applications. With a compact square package shape and versatile surface mount design, this chip carrier offers unmatched performance at a nominal supply voltage of 1.8V. Elevate your projects with the reliability and precision of Onsemi's NB7V58MMNHTBG, delivering value and efficiency to customers seeking superior quality components.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.24 ns

Low propagation delay ensures fast switching between inputs, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and labor costs.

No. of Inputs: 2

Having 2 inputs provides flexibility for multiplexing or demultiplexing signals in different configurations.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage, which can lead to energy efficiency and reduced power consumption.

No. of Terminals: 16

Having 16 terminals allows for multiple connection points, ensuring reliable signal transmission.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in mounting options and heat dissipation, catering to different application requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and reliability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in both hot and cold environments, increasing product versatility.

Terminal Finish: NICKEL GOLD PALLADIUM

High-quality terminal finish enhances conductivity and provides corrosion resistance, ensuring long-term performance.

Maximum Seated Height: 1 mm

Low seated height allows for compact PCB designs, saving space and enabling integration into small electronic devices.

Width: 3 mm

Narrow width makes this product suitable for applications with limited board space, offering flexibility in design layout.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies signal processing and enhances compatibility with other components in the system.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in demanding industrial applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging, enabling more functionality in a smaller footprint.

Technical Specifications

Multiplexer & Demultiplexer NB7V58MMNHTBG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

7V

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Propagation Delay At Nominal Supply:

.24 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB7V58MMNHTBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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