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NB7V585MMNR4G

Onsemi

NB7V585MMNR4G by Onsemi

NB7V585MMNR4G by Onsemi is a multiplexer/demultiplexer with 2 functions and inputs, 32 terminals, and 0.25 ns propagation delay at 1.8V. It operates in industrial temperatures (-40 to 85 °C) and has a package style of CHIP CARRIER. Ideal for high-speed signal switching applications.

Median Price

$16.100

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 425 parts In-Stock

1+ parts

$16.100

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$10.200

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425

$16.100

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Digiode

USA . 2,481 parts In-Stock

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$15.295

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$15.295

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Vyrian

USA . 3,889 parts In-Stock

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Flip Electronics

USA . 450 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 128 parts In-Stock

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$13.690

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128

$13.690

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Corphita

USA . 1,923 parts In-Stock

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$14.490

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Corohmni

South Africa . 54 parts In-Stock

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$16.100

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54

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AZTECH Wire

Italy . 796 parts In-Stock

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$20.730

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$20.730

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Component Stockers USA

USA . 405 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 5,399 parts In-Stock

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TANS Electronics

Latvia . 5,105 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,505 parts In-Stock

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SupplyDigital Components

Austria . 3,807 parts In-Stock

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Kulean Microsystems

USA . 3,362 parts In-Stock

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Perfect Parts

USA . 3,332 parts In-Stock

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GreenTree Electronics

Israel . 425 parts In-Stock

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Authorized Procurement Solutions

USA . 425 parts In-Stock

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Microchip USA

USA . 375 parts In-Stock

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UHIMA Technologies

Türkiye . 346 parts In-Stock

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346

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Overview

Discover the ultimate solution for your multiplexer & demultiplexer needs with the NB7V585MMNR4G by Onsemi. With a superior quality and precision engineering from Onsemi, this product offers unmatched performance and reliability. Ideal for a wide range of applications, this chip carrier style device boasts a very thin profile, making it perfect for compact designs. Experience the benefits of fast propagation delay, low power consumption, and versatile terminal options. Upgrade your projects with the NB7V585MMNR4G and unlock a world of possibilities in industrial temperature environments.

Feature Benefit Bullets

Propagation Delay At Nominal Supply 0.25 ns

Low propagation delay ensures fast data transmission, making this product suitable for high-speed applications.

Surface Mount YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Functions 2

Having multiple functions in a single component reduces the need for additional components, simplifying the circuit design and saving costs.

Package Shape SQUARE

Square package shape is space-efficient and provides a stable mounting surface, contributing to a compact and reliable design.

Nominal Supply Voltage / Vsup (V) 1.8

Operating at a standard 1.8V supply voltage ensures compatibility with a wide range of systems and power sources.

Maximum Operating Temperature 85 °C

With a high maximum operating temperature, this product can withstand harsh industrial environments without compromising performance.

Minimum Operating Temperature -40 °C

Wide operating temperature range makes this product suitable for use in both hot and cold conditions, increasing its versatility.

Terminal Form NO LEAD

No lead terminals offer RoHS compliance and are environmentally friendly, aligning with modern regulatory requirements.

Technical Specifications

Multiplexer & Demultiplexer NB7V585MMNR4G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

7V

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB7V585MMNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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