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NB7V586MMNR4G

Onsemi

NB7V586MMNR4G by Onsemi

NB7V586MMNR4G by Onsemi is a 2-input multiplexer with a propagation delay of 0.3 ns at 1.8V, suitable for industrial applications. This chip carrier package has a square shape, operates b/w -40 to 85 °C, and supports surface mount installation. With complementary output polarity and quad terminal position, it offers fast signal switching in compact designs.

Median Price

$8.176

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 7,000 parts In-Stock

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-

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$8.176

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7,000

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$8.176

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DigiKey

USA . 848 parts In-Stock

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100+ parts

$8.670

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848

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$8.670

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Flip Electronics (Authorized)

USA . 848 parts In-Stock

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848

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Rochester

USA . 662 parts In-Stock

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$8.120

1k+ parts

$7.270

10k+ parts

$6.840

662

-

$8.120

$7.270

$6.840

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,169 parts In-Stock

1+ parts

$8.578

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$8.578

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Flip Electronics

USA . 7,848 parts In-Stock

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Vyrian

USA . 5,438 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,383 parts In-Stock

1+ parts

$8.127

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$8.127

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Corohmni

South Africa . 371 parts In-Stock

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$9.480

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371

$9.480

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$25.158

100+ parts

$22.894

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$20.630

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900

$25.158

$22.894

$20.630

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QUARKTWIN TECHNOLOGY LTD

USA . 20,198 parts In-Stock

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Kulean Microsystems

USA . 7,745 parts In-Stock

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TANS Electronics

Latvia . 7,661 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,494 parts In-Stock

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Problanco Electronics

Mexico . 5,607 parts In-Stock

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SupplyDigital Components

Austria . 4,042 parts In-Stock

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Microchip USA

USA . 2,620 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Perfect Parts

USA . 314 parts In-Stock

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UHIMA Technologies

Türkiye . 147 parts In-Stock

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147

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Overview

Unlock unparalleled performance with the NB7V586MMNR4G from Onsemi, a leader in innovative semiconductor solutions. This high-speed multiplexer delivers lightning-fast switching and reliability, ideal for demanding industrial applications. With its compact design and robust temperature range, it ensures seamless integration into your systems while minimizing power consumption. Choose Onsemi for quality you can trust and elevate your projects to new heights!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.3 ns

A low propagation delay ensures high-speed performance, making it suitable for fast data applications.

Surface Mount: YES

Surface mount capability allows for efficient space utilization on PCBs, beneficial for compact designs.

No. of Inputs: 2

Having two inputs makes this multiplexer versatile for simple applications where minimal input selection is needed.

Package Shape: SQUARE

The square package shape optimizes space on the PCB and ensures uniform thermal distribution.

Nominal Supply Voltage / Vsup: 1.8 V

A nominal supply voltage of 1.8 V is suitable for modern low-voltage digital circuits, aiding power consumption reduction.

Power Supplies: 1.8 V

Single power supply simplifies design requirements and reduces system complexity.

No. of Terminals: 32

A higher number of terminals provides flexibility for various circuit configurations and modifications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging ensures easy integration and reliable connections in tight spaces.

Propagation Delay (tpd): 0.3 ns

Low propagation delay facilitates rapid switching, making it ideal for high-performance applications.

Maximum Operating Temperature: 85 °C

Supports a wide temperature range, making it suitable for industrial and harsh environment applications.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures increases reliability in extreme environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and reduces oxidation, ensuring better long-term reliability.

Terminal Position: QUAD

Quad terminal positioning aids in efficient routing and layout design on the circuit board.

Maximum Seated Height: 1 mm

A low seated height allows for slim-profile designs, appealing for compact electronic devices.

Width: 5 mm

Compact width is conducive to space-constrained designs without sacrificing performance.

Output Polarity: COMPLEMENTARY

Complementary output operation provides versatility in signal processing applications.

Minimum Supply Voltage (Vsup): 1.71 V

Low minimum supply voltage enhances compatibility with a variety of digital circuits.

Maximum Time At Peak Reflow Temperature: 30 s

Extended reflow time allows for better soldering during assembly, ensuring connection integrity.

Peak Reflow Temperature: 260 °C

High peak reflow temperature supports compatibility with lead-free soldering processes.

Length: 5 mm

Short length contributes to a compact overall footprint, which is ideal for miniaturized electronic applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in demanding environments.

Terminal Form: NO LEAD

No-lead design reduces the footprint and improves the performance of high-frequency applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for dense PCB designs, essential for modern electronic devices.

Maximum Supply Voltage (Vsup): 1.89 V

Allows for flexibility in power supply options while maintaining stable operation.

Technical Specifications

Multiplexer & Demultiplexer NB7V586MMNR4G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

7V

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Propagation Delay At Nominal Supply:

.3 ns

Propagation Delay (tpd):

.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB7V586MMNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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