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NB7V58MMNG

Onsemi

NB7V58MMNG by Onsemi

NB7V58MMNG by Onsemi is a 2-input multiplexer with a propagation delay of 0.24 ns at 1.8V, suitable for industrial applications. It features a chip carrier package style, operates b/w -40 to 85 °C, and has a terminal pitch of 0.5mm.

Median Price

$20.880

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 123 parts In-Stock

1+ parts

$20.880

100+ parts

$15.690

1k+ parts

$15.690

10k+ parts

$13.850

123

$20.880

$15.690

$15.690

$13.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,504 parts In-Stock

1+ parts

$19.836

100+ parts

-

1k+ parts

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10k+ parts

-

1,504

$19.836

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Vyrian

USA . 8,146 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,146

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Chip Stock

USA . 375 parts In-Stock

1+ parts

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375

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 123 parts In-Stock

1+ parts

$17.750

100+ parts

-

1k+ parts

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10k+ parts

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123

$17.750

-

-

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Corphita

USA . 1,423 parts In-Stock

1+ parts

$18.792

100+ parts

-

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1,423

$18.792

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-

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Component Stockers USA

USA . 22 parts In-Stock

1+ parts

$20.130

100+ parts

-

1k+ parts

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22

$20.130

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Corohmni

South Africa . 87 parts In-Stock

1+ parts

$20.880

100+ parts

-

1k+ parts

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10k+ parts

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87

$20.880

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Microchip USA

USA . 1,645 parts In-Stock

1+ parts

$50.416

100+ parts

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1k+ parts

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10k+ parts

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1,645

$50.416

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Problanco Electronics

Mexico . 7,891 parts In-Stock

1+ parts

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7,891

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SupplyDigital Components

Austria . 4,064 parts In-Stock

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4,064

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Kulean Microsystems

USA . 2,094 parts In-Stock

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2,094

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TANS Electronics

Latvia . 1,555 parts In-Stock

1+ parts

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1,555

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UHIMA Technologies

Türkiye . 304 parts In-Stock

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304

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Perfect Parts

USA . 20 parts In-Stock

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20

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Overview

Elevate your design with the NB7V58MMNG multiplexer from Onsemi, a trusted leader in high-performance solutions. This ultra-compact, surface-mount device delivers lightning-fast propagation delays and operates efficiently across a wide temperature range. Ideal for industrial applications, it ensures reliability and precision in signal management, enhancing your systems' performance. Choose Onsemi for unparalleled quality and innovation that translate to superior value for your projects.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.24 ns

A low propagation delay enhances the speed and performance of data transmission, making this multiplexer an excellent choice for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into various circuit layouts, suitable for modern electronics.

No. of Inputs: 2

With two inputs, this multiplexer is simple and effective for basic signal routing scenarios, ensuring versatility in design.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy alignment during assembly and soldering.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage contributes to lower power consumption, making it ideal for battery-operated devices.

Power Supplies (V): 1.8/3.3

Supporting dual supply voltages increases compatibility with various digital systems, offering flexibility in application.

No. of Terminals: 16

Having 16 terminals enables numerous connections in circuit designs, providing ample options for signal routing.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink design allow for improved thermal management and efficient use of space on the PCB.

Propagation Delay (tpd): 22 ns

Maintaining a reasonable propagation delay of 22 ns ensures good performance in various digital applications, balancing speed and reliability.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature allows it to function reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The capability to operate in extreme low temperatures makes this multiplexer suitable for applications in harsh environments.

Terminal Finish: NICKEL GOLD PALLADIUM

This durable terminal finish enhances reliability and longevity, ensuring robust connections in electronic circuits.

Terminal Position: QUAD

Quad terminal positioning facilitates better layout options and routing in multi-layered circuit boards.

Maximum Seated Height: 1 mm

The low seated height is advantageous for space-constrained designs, allowing for a flatter profile.

Width: 3 mm

A compact width aids in creating more efficient and dense PCB layouts, vital for modern electronics.

Output Polarity: COMPLEMENTARY

Complementary output polarity is beneficial for applications requiring inverting signals, enhancing design flexibility.

Minimum Supply Voltage (Vsup): 1.71 V

The ability to operate at a low minimum supply voltage supports a wider range of battery-powered devices, increasing usability.

Maximum Time At Peak Reflow Temperature (s): 30

Long maximum time at peak reflow temperature means compatibility with various soldering processes, ensuring reliable assembly.

Peak Reflow Temperature (°C): 260

The high reflow temperature capability allows use in different manufacturing processes without risk of damage.

Length: 3 mm

A compact length of 3 mm contributes to the overall small form factor, ideal for space-sensitive electronic designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in various applications, maintaining functionality under harsh conditions.

Terminal Form: NO LEAD

No lead terminal form enhances environmental safety and improves manufacturability, meeting modern compliance standards.

Terminal Pitch: 0.5 mm

A smaller terminal pitch supports higher density layouts, allowing for more components in limited spaces.

Maximum Supply Voltage (Vsup): 3.6 V

The higher maximum supply voltage expands the range of applications suitable for this multiplexer, catering to more demanding systems.

Technical Specifications

Multiplexer & Demultiplexer NB7V58MMNG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

7V

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Propagation Delay At Nominal Supply:

.24 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB7V58MMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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