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PCA8550DBLE

Texas Instruments

PCA8550DBLE by Texas Instruments

PCA8550DBLE by Texas Instruments is a 16-terminal multiplexer with Vsup ranging from 3V to 3.6V. It operates b/w 0°C to 70°C, making it ideal for commercial applications. The small outline package measures 6.2mm x 5.3mm with a terminal pitch of 0.65mm, suitable for surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,991 parts In-Stock

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4,991

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Digiode

USA . 1,708 parts In-Stock

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1,708

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 871 parts In-Stock

1+ parts

$8.839

100+ parts

-

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871

$8.839

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Parana Technologies

USA . 776 parts In-Stock

1+ parts

$15.388

100+ parts

-

1k+ parts

$15.775

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776

$15.388

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$15.775

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DigiPath Technology Company

USA . 1,507 parts In-Stock

1+ parts

$16.944

100+ parts

$15.589

1k+ parts

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1,507

$16.944

$15.589

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ChromeModa Solutions

Germany . 5,544 parts In-Stock

1+ parts

$17.290

100+ parts

$14.178

1k+ parts

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5,544

$17.290

$14.178

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IDEA Electronic Components Group

UK . 578 parts In-Stock

1+ parts

$17.290

100+ parts

$16.426

1k+ parts

$15.561

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578

$17.290

$16.426

$15.561

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One Stop Electronics

USA . 929 parts In-Stock

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$20.000

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929

$20.000

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Corphita

USA . 721 parts In-Stock

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721

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Overview

Elevate your circuit design with the PCA8550DBLE by Texas Instruments, a top-tier manufacturer known for delivering high-quality solutions. This multiplexer and demultiplexer offers unparalleled performance in a compact rectangular package, making it ideal for a wide range of applications. With a nominal supply voltage of 3.3V and commercial temperature grade, this versatile component ensures reliable operation in any setting. Trust Texas Instruments to provide innovative technology and superior products that exceed expectations. Upgrade your projects today with the PCA8550DBLE and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components of the multiplexer/demultiplexer.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common power supply voltages, ensuring widespread usability.

Maximum Operating Temperature: 70 °C

Can withstand high temperature environments, providing reliability in various applications.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, optimizing performance.

Technical Specifications

Multiplexer & Demultiplexer PCA8550DBLE attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

6.2 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

PCA8550DBLE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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