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SNJ54AS257J-00

Texas Instruments

SNJ54AS257J-00 by Texas Instruments

SNJ54AS257J-00 by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 10.5 ns and operates b/w -55 to 125°C. It has a supply voltage range of 4.5V to 5.5V, making it suitable for military-grade applications requiring high-speed signal switching in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,068 parts In-Stock

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2,068

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Digiode

USA . 284 parts In-Stock

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284

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Distributors (Availability)

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AZTECH Wire

Italy . 260 parts In-Stock

1+ parts

$7.300

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260

$7.300

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Parana Technologies

USA . 1,239 parts In-Stock

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$28.607

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$49.480

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1,239

$28.607

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$49.480

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DigiPath Technology Company

USA . 524 parts In-Stock

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$31.500

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524

$31.500

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ChromeModa Solutions

Germany . 3,580 parts In-Stock

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$32.143

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$26.357

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3,580

$32.143

$26.357

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IDEA Electronic Components Group

UK . 20 parts In-Stock

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$32.143

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$30.536

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$28.929

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20

$32.143

$30.536

$28.929

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One Stop Electronics

USA . 414 parts In-Stock

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$40.000

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414

$40.000

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Corphita

USA . 4,409 parts In-Stock

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Overview

Unlock the power of multiplexing with Texas Instruments' SNJ54AS257J-00. This high-quality ceramic and glass-sealed package offers 4 functions and 2 inputs, making it perfect for a wide range of applications. With a nominal supply voltage of 5V and a fast propagation delay of 10.5ns, this versatile device is ideal for military-grade projects requiring precision and reliability. Trust in Texas Instruments to deliver cutting-edge technology that meets your demands for performance and efficiency. Elevate your designs with the SNJ54AS257J-00 today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent durability and reliability, making the product suitable for harsh operating conditions.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard electronic systems.

Propagation Delay (tpd): 10.5 ns

The low propagation delay helps in fast data transmission, making the product efficient for high-speed applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can function reliably in elevated temperature environments.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of digital systems, making the product versatile.

Technical Specifications

Multiplexer & Demultiplexer SNJ54AS257J-00 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AS

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

30.6 mA

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SNJ54AS257J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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