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SNJ54153J

Texas Instruments

SNJ54153J by Texas Instruments

SNJ54153J by Texas Instruments is a TTL multiplexer with 2 functions, 4 inputs, and 16 terminals. It has a propagation delay of 14 ns at 5V supply voltage, making it ideal for military applications requiring fast switching speeds. With MIL-PRF-38535 screening level and TIN LEAD terminal finish, this ceramic package device operates b/w -55 to 125 °C temperature range.

Median Price

$4.602

Lifecycle Status

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American Microsemiconductor Inc.

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Corel Iberica Componentes, S.L.

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Mil-Aero Solutions, Inc.

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Prism Electronics

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Inland Empire Components Inc.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

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IDEA Electronic Components Group

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AZTECH Wire

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Overview

Boost your electronic projects with the SNJ54153J from Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This versatile multiplexer/demultiplexer offers seamless signal routing and processing, making it ideal for a wide range of applications. With fast propagation delays and robust construction, this product ensures reliable performance in demanding environments. Upgrade your designs today with the SNJ54153J and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed body material ensures durability and reliable performance in various environmental conditions.

Propagation Delay at Nominal Supply: 14 ns

With a low propagation delay, this multiplexer/demultiplexer ensures fast switching between functions, making it suitable for high-speed applications.

No. of Functions: 2

Having multiple functions in one device provides versatility and saves space on the circuit board.

No. of Inputs: 4

With 4 inputs, this multiplexer/demultiplexer can handle multiple signal sources efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with a wide range of systems and simplifies power requirements.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this multiplexer/demultiplexer offers ruggedness and reliability for demanding applications.

Technology: TTL

Using TTL technology ensures compatibility with TTL logic levels, making integration into existing systems easier.

Maximum Power Supply Current (ICC): 52 mA

Consuming low power of 52mA, this multiplexer/demultiplexer is energy-efficient and helps in reducing overall power consumption.

Technical Specifications

Multiplexer & Demultiplexer SNJ54153J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

16 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

52 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

23 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SNJ54153J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-329-8166, 5962003298166, 5962-01-090-8858, 5962010908858, 5962-01-193-5856, 5962011935856, 5962-99-797-8294, 5962997978294

NIIN

003298166, 010908858, 011935856, 997978294

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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