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CD74HC151E

Texas Instruments

CD74HC151E by Texas Instruments

CD74HC151E by Texas Instruments is an 8-input multiplexer with a propagation delay of 43ns at 4.5V supply, ideal for military-grade applications. It operates on a supply voltage range of 2-6V, has a max operating temperature of 125°C, and features complementary output polarity. With through-hole terminal form and nickel/palladium/gold finish, it offers high reliability in various electronic systems.

Median Price

$0.377

Lifecycle Status

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33

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1k+

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Arrow

USA . 1,378 parts In-Stock

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DigiKey

USA . 1,502 parts In-Stock

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Mouser Electronics

USA . 603 parts In-Stock

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Rochester

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Verical

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Chip1Stop

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Avnet

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Freelance Electronics

USA . 90 parts In-Stock

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Digiode

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Vyrian

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TEDSS.com

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Component Electronics Inc.

Canada . 1,025 parts In-Stock

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TME

Poland . 843 parts In-Stock

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DigiKey Marketplace

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ComSIT Distribution GmbH

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First Choice Components Inc.

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Electronic Expediters

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Sunrise Surplus Inc.

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LittleDiode

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Distributors (Availability)

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Corphita

USA . 1,901 parts In-Stock

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Northwest PG Solutions

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Microchip USA

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 4,927 parts In-Stock

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IDEA Electronic Components Group

UK . 1,192 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Glotronic Ltd.

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Overview

Upgrade your electronic projects with the Texas Instruments CD74HC151E multiplexer & demultiplexer. With a reputation for high-quality products, Texas Instruments delivers a reliable component that offers fast propagation delay and a wide range of operating temperatures. Perfect for applications requiring data selection and distribution, this 8-bit multiplexer will streamline your circuit design process and enhance overall performance. Trust Texas Instruments to provide value, benefits, and advantages in every product they offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and insulation, making the product suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 43 ns

Low propagation delay ensures efficient and fast signal processing within the multiplexer/demultiplexer.

No. of Inputs: 8

Having 8 inputs allows for versatile input configurations and connectivity options.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage of 4.5V ensures stable and reliable operation of the device.

Maximum Operating Temperature: 125 °C

High operating temperature range of 125°C makes the product suitable for industrial and harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the multiplexer/demultiplexer.

Technical Specifications

Multiplexer & Demultiplexer CD74HC151E attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

43 ns

Propagation Delay (tpd):

280 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD74HC151E Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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