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CD74AC151M96E4

Texas Instruments

CD74AC151M96E4 by Texas Instruments

CD74AC151M96E4 by Texas Instruments is a CMOS multiplexer with 8 inputs and 16 terminals. It has a propagation delay of 20.9 ns at 3.3V, making it suitable for military-grade applications requiring fast switching capabilities in compact spaces. With a small outline package style and surface mount compatibility, this device is ideal for high-performance electronic systems operating within a wide temperature range from -55°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,653 parts In-Stock

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Digiode

USA . 2,363 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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Corohmni

South Africa . 712 parts In-Stock

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$11.751

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712

$11.751

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AZTECH Wire

Italy . 533 parts In-Stock

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$18.243

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One Stop Electronics

USA . 825 parts In-Stock

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$24.000

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Ampacity Inc.

Singapore . 590 parts In-Stock

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$29.000

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Parana Technologies

USA . 2,285 parts In-Stock

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$29.588

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$60.918

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ChromeModa Solutions

Germany . 3,200 parts In-Stock

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$33.245

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$27.261

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IDEA Electronic Components Group

UK . 2,174 parts In-Stock

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$29.920

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Semicontronic

India . 1,031 parts In-Stock

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$43.875

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Continental Prestige Electronics

USA . 6,562 parts In-Stock

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Argo Parts USA

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Corphita

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DigiPath Technology Company

USA . 1,287 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Enhance your electronics projects with the CD74AC151M96E4 by Texas Instruments, a top-of-the-line multiplexer/demultiplexer that offers unparalleled quality and reliability. Crafted with precision by Texas Instruments, this versatile component is perfect for a wide range of applications. From enhancing circuit designs to optimizing signal processing, this product delivers exceptional performance and efficiency. Trust in Texas Instruments to provide you with the best tools for your projects, and experience the superior value and benefits that the CD74AC151M96E4 brings to the table. Elevate your creations with this high-quality component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Propagation Delay At Nominal Supply: 20.9 ns

Low propagation delay ensures fast data processing and transfer, making the product efficient.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the product onto circuit boards, saving space and simplifying assembly.

No. of Inputs: 8

Having 8 inputs provides flexibility in connecting multiple input sources to the multiplexer/demultiplexer, enhancing its functionality.

Nominal Supply Voltage / Vsup: 3.3V

Operating at 3.3V nominal supply voltage is common in many electronic systems, ensuring compatibility with existing circuitry.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable performance and efficient signal processing in the multiplexer/demultiplexer.

Power Supplies (V): 3.3/5

Supporting both 3.3V and 5V power supplies allows for versatile compatibility with different systems and components.

Maximum I (ol): 12 Amp

High maximum output current of 12 Amp enables the product to drive heavy loads with ease, expanding its utility.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the product can withstand high-temperature environments, increasing its reliability.

Minimum Operating Temperature: -55 °C

The product's minimum operating temperature of -55°C ensures functionality even in low-temperature conditions, making it suitable for a wide range of applications.

Terminal Position: DUAL

Dual terminal position provides improved connectivity options and ensures secure connections for reliable performance.

Width: 3.9 mm

Compact width of 3.9 mm allows for efficient use of space on circuit boards, enabling dense and compact electronic designs.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures that the product can operate reliably in extreme conditions and harsh environments.

Technical Specifications

Multiplexer & Demultiplexer CD74AC151M96E4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

20.9 ns

Propagation Delay (tpd):

186 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74AC151M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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