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NB7V585MMNG

Onsemi

NB7V585MMNG by Onsemi

NB7V585MMNG by Onsemi is a multiplexer/demultiplexer with 2 functions and inputs, featuring a propagation delay of 0.25 ns. It operates at a nominal voltage of 1.8V, suitable for industrial applications requiring fast signal processing in tight spaces. With surface mount capability and compact dimensions (5mm x 5mm), it offers efficient performance in temperature-sensitive environments up to 85 °C.

Median Price

$6.250

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,018 parts In-Stock

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$6.250

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Digiode

USA . 202 parts In-Stock

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202

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 365 parts In-Stock

1+ parts

$6.250

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365

$6.250

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SupplyDigital Components

Austria . 7,035 parts In-Stock

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7,035

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Kulean Microsystems

USA . 6,218 parts In-Stock

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TANS Electronics

Latvia . 4,499 parts In-Stock

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4,499

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Continental Prestige Electronics

USA . 2,116 parts In-Stock

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Corphita

USA . 1,288 parts In-Stock

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Problanco Electronics

Mexico . 679 parts In-Stock

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Perfect Parts

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Kepictronics

USA . 350 parts In-Stock

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UHIMA Technologies

Türkiye . 83 parts In-Stock

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Overview

Unlock unparalleled performance with the NB7V585MMNG from Onsemi—a leader in innovative semiconductor solutions. This high-quality multiplexer offers lightning-fast propagation delays, ensuring seamless data transmission for your demanding applications. With its compact design and robust temperature range, it's perfect for industrial environments where reliability is key. Elevate your projects with this versatile component that brings efficiency and reliability to the forefront!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.25 ns

With an extremely low propagation delay, this multiplexer/demultiplexer offers fast switching times, making it ideal for high-speed applications.

Surface Mount: YES

The surface mount design facilitates easy integration into compact PCB layouts, saving space and simplifying assembly.

No. of Functions: 2

Offering multiple functions, this device provides versatility for various applications, reducing the need for additional components.

No. of Inputs: 2

With two inputs, this device is suitable for simple applications that require basic multiplexing or demultiplexing solutions.

Package Shape: SQUARE

The square package shape enhances layout flexibility and may improve thermal performance in various designs.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage allows this device to be power-efficient, making it suitable for battery-powered applications.

Power Supplies (V): 1.8/2.5

With support for multiple supply voltages, this device can be adapted easily into different system designs.

No. of Terminals: 32

The high number of terminals allows for numerous connections and capabilities, enhancing system integration.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The compact profile and heat sinking capability make it suitable for high-density applications where thermal management is critical.

Propagation Delay (tpd): 250 ns

Although this value appears higher than the nominal supply delay, it indicates reliable performance in various operational conditions.

Maximum Operating Temperature: 85 °C

A wide operating temperature range ensures reliability in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating reliably in low temperatures expands usability in challenging environments such as automotive and outdoor applications.

Terminal Finish: TIN

The tin finish provides good solderability and ensures durability, enhancing the product's longevity.

Terminal Position: QUAD

Quad terminal positioning allows for efficient use of PCB space and straightforward routing of signals.

Maximum Seated Height: 1 mm

A low maximum seated height makes this device suitable for applications where height is a constraint.

Width: 5 mm

The compact width allows for efficient use in space-constrained designs.

Output Polarity: COMPLEMENTARY

Complementary output features enhance the device's utility in various digital applications, improving signal integrity.

Minimum Supply Voltage (Vsup): 1.71 V

The capability to operate at low supply voltages is beneficial for low-power applications, enhancing battery life.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard surface mount soldering processes, enhancing manufacturability.

Peak Reflow Temperature °C: 260

A high peak reflow temperature allows for versatile soldering processes, accommodating various PCB assembly technologies.

Length: 5 mm

Lengthwise compact design contributes to overall efficiency in PCB layout, making integration easier.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the device is built to withstand demanding operational conditions, providing reliability.

Terminal Form: NO LEAD

No lead configuration enhances the overall environmental footprint and improves assembly ergonomics.

Terminal Pitch: 0.5 mm

The tight terminal pitch allows for a high-density connection, making it suitable for compact electronic applications.

Maximum Supply Voltage (Vsup): 1.89 V

This specification gives flexible options for voltage supply, allowing users to select the most appropriate for their designs.

Technical Specifications

Multiplexer & Demultiplexer NB7V585MMNG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

7V

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB7V585MMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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