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MC74ACT157DG

Onsemi

MC74ACT157DG by Onsemi

MC74ACT157DG by Onsemi is a 4-function multiplexer with 2 inputs, operating at 5V. It has a propagation delay of 8.5ns and can handle a load capacitance of 50pF. Ideal for industrial applications requiring fast switching capabilities in compact designs.

Median Price

$0.371

Lifecycle Status

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27

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1k+

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Arrow

USA . 2,163 parts In-Stock

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$0.106

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Farnell

UK . 526 parts In-Stock

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$0.422

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$0.272

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$0.249

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$0.204

526

$0.422

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$0.249

$0.204

Newark

USA . 511 parts In-Stock

1+ parts

$0.505

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$0.322

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$0.251

511

$0.505

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Mouser Electronics

USA . 493 parts In-Stock

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$0.580

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$0.329

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$0.250

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$0.244

493

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$0.244

DigiKey

USA . 112 parts In-Stock

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$0.600

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$0.356

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$0.294

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$0.264

112

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$0.264

Element14

Singapore . 526 parts In-Stock

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$0.738

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$0.454

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$0.366

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$0.352

526

$0.738

$0.454

$0.366

$0.352

Rochester

USA . 38,291 parts In-Stock

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-

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$0.320

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$0.266

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$0.237

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Verical

USA . 20,736 parts In-Stock

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Avnet

USA . 2,976 parts In-Stock

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Chip1Stop

Japan . 2,681 parts In-Stock

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$0.147

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$0.140

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$0.117

2,681

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$0.117

Future Electronics

Canada . 284 parts In-Stock

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$0.174

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$0.169

284

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Digiode

USA . 310 parts In-Stock

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$0.101

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310

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Nova Conductors

Japan . 33 parts In-Stock

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$0.341

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TME

Poland . 238 parts In-Stock

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$0.570

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NAC Semi

USA . 9,504 parts In-Stock

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$0.470

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$0.423

9,504

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$0.423

Vyrian

USA . 6,135 parts In-Stock

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Flip Electronics

USA . 5,616 parts In-Stock

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Bristol Electronics

USA . 507 parts In-Stock

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Atlantic Semiconductor

USA . 450 parts In-Stock

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450

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IBS Electronics

USA . 284 parts In-Stock

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$0.244

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$0.237

284

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$0.237

ACDS - Activité Composants Distribution Service

France . 70 parts In-Stock

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Holdelec - ElecDif-Pro

France . 70 parts In-Stock

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Inventory MP

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EMSNET

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LittleDiode

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Prism Electronics

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Quantum Digital Technology

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Distributors (Availability)

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Corphita

USA . 248 parts In-Stock

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$0.095

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Corohmni

South Africa . 482 parts In-Stock

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Continental Prestige Electronics

USA . 1,129 parts In-Stock

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$0.389

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$0.232

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$0.177

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$0.162

1,129

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$0.162

Aztec Data Supply Inc.

USA . 673 parts In-Stock

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$21.220

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Problanco Electronics

Mexico . 8,168 parts In-Stock

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TANS Electronics

Latvia . 7,914 parts In-Stock

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Perfect Parts

USA . 7,851 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 3,475 parts In-Stock

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Eastek

USA . 2,976 parts In-Stock

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Argo Parts USA

USA . 2,689 parts In-Stock

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UHIMA Technologies

Türkiye . 197 parts In-Stock

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SupplyDigital Components

Austria . 191 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.334

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$0.324

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$0.317

100

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$0.334

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Overview

Enhance your electronic projects with the MC74ACT157DG by Onsemi, a top-quality multiplexer & demultiplexer that delivers reliable performance and precise functionality. With a compact design and advanced CMOS technology, this product offers seamless integration and exceptional versatility for a wide range of applications in industrial settings. Trust in Onsemi's reputation for excellence and innovation to bring you a cost-effective solution that exceeds expectations. Upgrade your projects today with the MC74ACT157DG and experience the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

No. of Functions: 4

Having 4 functions in one device increases efficiency and saves space on the PCB.

No. of Inputs: 2

Having 2 inputs allows for versatile signal routing and switching capabilities.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal 5V voltage makes it compatible with standard electronic systems.

Load Capacitance (CL): 50 pF

Having a low load capacitance helps in faster signal processing.

Power Supplies (V): 5

Matching power supply voltage ensures optimal performance.

No. of Terminals: 16

Having 16 terminals allows for flexibility in connecting to other components.

Maximum I (ol): 24 Amp

High output current capability supports the handling of larger signals.

Propagation Delay (tpd): 8.5 ns

Low propagation delay ensures quick switching of signals.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for various environments.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperatures increases the product's versatility.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for easy mounting on the PCB.

Maximum Seated Height: 1.75 mm

Low seated height helps in space-constrained applications.

Width: 3.9 mm

Compact width saves space on the PCB.

Output Polarity: TRUE

True output polarity ensures correct signal switching.

Minimum Supply Voltage (Vsup): 4.5 V

Support for a low minimum supply voltage allows for operation in lower power scenarios.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable solder joints.

Length: 9.9 mm

Optimal length for easy PCB integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form aids in proper soldering and mounting on the PCB.

Packing Method: RAIL

Rail packing method facilitates easy handling and storage.

Terminal Pitch: 1.27 mm

Standard terminal pitch for widespread compatibility with PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance ensures robustness against power fluctuations.

Maximum Power Supply Current (ICC): 0.08 mA

Low power supply current requirement helps in energy efficiency.

Technical Specifications

Multiplexer & Demultiplexer MC74ACT157DG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

TTL COMPATIBLE INPUTS

Family:

ACT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74ACT157DG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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