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MC74AC153DT

Onsemi

MC74AC153DT by Onsemi

MC74AC153DT by Onsemi is a CMOS multiplexer with 2 functions, 4 inputs, and 16 terminals. It operates at a supply voltage of 3.3/5V with a propagation delay of 14.5ns. Ideal for industrial applications requiring true output polarity in a compact small outline package.

Median Price

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Lifecycle Status

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2

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< 1k

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Digiode

USA . 587 parts In-Stock

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Vyrian

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Kulean Microsystems

USA . 7,598 parts In-Stock

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TANS Electronics

Latvia . 6,943 parts In-Stock

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Problanco Electronics

Mexico . 6,223 parts In-Stock

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SupplyDigital Components

Austria . 4,907 parts In-Stock

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UHIMA Technologies

Türkiye . 980 parts In-Stock

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Corphita

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Corohmni

South Africa . 88 parts In-Stock

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Overview

Discover the cutting-edge MC74AC153DT by Onsemi, a top-tier manufacturer in the industry of Multiplexer & Demultiplexer components. This high-quality product offers customers unparalleled reliability and performance, making it ideal for a wide range of applications. With its advanced technology and precision engineering, the MC74AC153DT provides exceptional value and benefits to users, ensuring seamless operation and maximum efficiency. Upgrade your projects with this innovative solution and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects internal components, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 14.5 ns

Allows for quick transmission of data, ensuring efficient performance.

Surface Mount: YES

Enables easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage levels, making it versatile and widely applicable.

Power Supplies (V): 3.3/5

Offers flexibility in power input options, accommodating different system requirements.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments, suitable for industrial use.

Technology: CMOS

Utilizes CMOS technology known for low power consumption and high noise immunity, enhancing energy efficiency and signal integrity.

Technical Specifications

Multiplexer & Demultiplexer MC74AC153DT attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74AC153DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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