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MC74AC151DR2

Onsemi

MC74AC151DR2 by Onsemi

MC74AC151DR2 by Onsemi is an 8-input multiplexer with a propagation delay of 16ns at 5V. It operates on power supplies of 3.3/5V, has a load capacitance of 50pF, and can handle a max I (ol) of 12A. This small outline package is ideal for industrial applications requiring fast signal switching in compact spaces.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,250 parts In-Stock

1+ parts

-

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$0.132

1k+ parts

$0.110

10k+ parts

$0.098

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$0.132

$0.110

$0.098

DigiKey

USA . 11,250 parts In-Stock

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$0.170

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$0.170

Verical

USA . 11,250 parts In-Stock

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$0.122

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$0.122

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Digiode

USA . 470 parts In-Stock

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$0.103

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$0.103

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Vyrian

USA . 2,317 parts In-Stock

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$0.108

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DigiKey Marketplace

USA . 11,250 parts In-Stock

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ComSIT Distribution GmbH

Germany . 609 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,200 parts In-Stock

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$0.097

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$0.097

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Corohmni

South Africa . 486 parts In-Stock

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$0.108

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486

$0.108

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Continental Prestige Electronics

USA . 11,250 parts In-Stock

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$0.094

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Problanco Electronics

Mexico . 6,248 parts In-Stock

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Kulean Microsystems

USA . 5,944 parts In-Stock

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SupplyDigital Components

Austria . 4,694 parts In-Stock

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TANS Electronics

Latvia . 3,376 parts In-Stock

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UHIMA Technologies

Türkiye . 430 parts In-Stock

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Overview

Enhance your electronic projects with the MC74AC151DR2 multiplexer from Onsemi, a renowned manufacturer known for top-quality components. This versatile device offers seamless signal switching capabilities, making it ideal for a wide range of applications. With its fast propagation delay and low power consumption, this multiplexer provides exceptional performance while maximizing efficiency. Experience the reliability and precision of Onsemi products with the MC74AC151DR2, and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring reliability in various environments.

Propagation Delay At Nominal Supply: 16 ns

Low propagation delay of 16 ns ensures fast data transmission and processing, making this product suitable for applications that require quick response times.

No. of Inputs: 8

Having 8 inputs allows for versatile configurations and connectivity options, increasing the flexibility of the multiplexer/demultiplexer.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes the multiplexer/demultiplexer compatible with standard power sources, simplifying integration into existing systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can function reliably in high-temperature environments, expanding its range of applications.

Technical Specifications

Multiplexer & Demultiplexer MC74AC151DR2 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

12 Amp

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC74AC151DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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