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MC74AC153D

Onsemi

MC74AC153D by Onsemi

MC74AC153D by Onsemi is a CMOS multiplexer with 2 functions, 4 inputs, and 16 terminals. It operates at a supply voltage of 3.3/5V with a propagation delay of 14.5ns, suitable for industrial applications requiring high-speed signal switching in compact designs.

Median Price

$0.211

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,337 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

1,337

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$0.211

$0.175

$0.156

Distributors (In-Stock)

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Digiode

USA . 2,247 parts In-Stock

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$0.164

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2,247

$0.164

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Vyrian

USA . 2,442 parts In-Stock

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$0.173

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2,442

$0.173

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Component Electronics Inc.

Canada . 20 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

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$0.500

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-

20

$0.770

$0.580

$0.500

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American Microsemiconductor Inc.

USA . 44 parts In-Stock

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$1.380

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44

$1.380

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Bristol Electronics

USA . 4,588 parts In-Stock

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4,588

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Inland Empire Components Inc.

USA . 76 parts In-Stock

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Prism Electronics

USA . 66 parts In-Stock

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66

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Resion

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Q Components

USA . 18 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,394 parts In-Stock

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$0.156

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$0.156

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Corohmni

South Africa . 90 parts In-Stock

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$0.173

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90

$0.173

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Benley Electronics

USA . 61 parts In-Stock

1+ parts

$0.400

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61

$0.400

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Microchip USA

USA . 4,093 parts In-Stock

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$1.105

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Kulean Microsystems

USA . 8,284 parts In-Stock

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TANS Electronics

Latvia . 6,195 parts In-Stock

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SupplyDigital Components

Austria . 2,905 parts In-Stock

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2,905

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Problanco Electronics

Mexico . 536 parts In-Stock

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UHIMA Technologies

Türkiye . 405 parts In-Stock

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Perfect Parts

USA . 55 parts In-Stock

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Overview

Unlock endless possibilities with the MC74AC153D by Onsemi, a high-quality multiplexer & demultiplexer that boasts exceptional performance and reliability. Designed for industrial applications, this versatile device offers seamless integration, fast propagation delay, and true output polarity. With Onsemi's proven track record of excellence in semiconductor manufacturing, customers can trust in the value, benefits, and advantages that the MC74AC153D brings to their projects. Say goodbye to limitations and hello to innovation with this top-of-the-line solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the multiplexer & demultiplexer, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 14.5 ns

The low propagation delay of 14.5 ns ensures fast and efficient data transmission within the multiplexer & demultiplexer, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes the multiplexer & demultiplexer easy to install on printed circuit boards, saving space and simplifying the overall design.

No. of Functions: 2

Having 2 functions in one device provides versatility and flexibility in data routing and signal processing, making it a cost-effective solution for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V offers compatibility with standard power sources, ensuring ease of integration into existing systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF allows for efficient signal handling and transmission, resulting in reliable performance in different circuit configurations.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the multiplexer & demultiplexer can function reliably in various environmental conditions, enhancing its overall durability.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making the multiplexer & demultiplexer energy-efficient and reliable for long-term use.

Technical Specifications

Multiplexer & Demultiplexer MC74AC153D attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC74AC153D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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