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MC741VHC157DTR2

Onsemi

MC741VHC157DTR2 by Onsemi

MC741VHC157DTR2 by Onsemi is a 4:1 multiplexer with 2 inputs, operating at 3.3V. With a propagation delay of 15ns and industrial temperature grade, it's ideal for high-speed signal routing in compact electronic systems. This CMOS technology device comes in a small outline package with surface mount capability, making it suitable for various industrial applications requiring efficient data selection.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 757 parts In-Stock

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SupplyDigital Components

Austria . 5,960 parts In-Stock

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Kulean Microsystems

USA . 5,810 parts In-Stock

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Problanco Electronics

Mexico . 4,079 parts In-Stock

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Corphita

USA . 2,013 parts In-Stock

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TANS Electronics

Latvia . 1,713 parts In-Stock

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Corohmni

South Africa . 435 parts In-Stock

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UHIMA Technologies

Türkiye . 100 parts In-Stock

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Overview

Enhance your electronic designs with the MC741VHC157DTR2 by Onsemi. This high-quality multiplexer offers customers a reliable and efficient solution for their circuit needs. With a wide range of applications in various industries, this product provides value by streamlining processes and improving overall performance. Trust in Onsemi's expertise and innovation to deliver top-of-the-line products that meet your requirements and exceed expectations. Elevate your projects with the MC741VHC157DTR2 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to external factors, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and making installation more convenient.

No. of Functions: 4

Having 4 functions in one device offers versatility and efficiency in signal routing and processing, reducing the need for multiple separate components.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V makes it compatible with a wide range of systems and applications, offering flexibility in usage.

Propagation Delay (tpd): 15 ns

With a low propagation delay of 15ns, this multiplexer/demultiplexer ensures fast signal processing and minimal latency in data transmission.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the product to function reliably even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the product can perform effectively in cold environments without any issues.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer MC741VHC157DTR2 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC741VHC157DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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