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JM38510/07906BFA

Texas Instruments

JM38510/07906BFA by Texas Instruments

JM38510/07906BFA by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at a supply voltage range of 4.5V to 5.5V. It features a propagation delay of 7.5ns, max current of 20A, and operates in temperatures ranging from -55°C to 125°C. Ideal for military-grade applications requiring high-speed signal switching in compact spaces.

Median Price

$22.186

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 335 parts In-Stock

1+ parts

$19.783

100+ parts

$20.772

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$19.585

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$19.783

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NAC Semi

USA . 18 parts In-Stock

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$24.590

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Vyrian

USA . 7,286 parts In-Stock

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Digiode

USA . 1,253 parts In-Stock

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Resion

USA . 246 parts In-Stock

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Electronic Expediters

USA . 120 parts In-Stock

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Mil-Aero Solutions, Inc.

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Distributors (Availability)

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AZTECH Wire

Italy . 243 parts In-Stock

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$19.619

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$19.619

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Parana Technologies

USA . 1,718 parts In-Stock

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$29.253

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$57.308

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ChromeModa Solutions

Germany . 5,726 parts In-Stock

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$32.869

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$26.953

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IDEA Electronic Components Group

UK . 1,512 parts In-Stock

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$32.869

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$31.226

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$29.582

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One Stop Electronics

USA . 357 parts In-Stock

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$55.000

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DigiPath Technology Company

USA . 1,777 parts In-Stock

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$29.635

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Microchip USA

USA . 1,136 parts In-Stock

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Corphita

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Overview

Upgrade your electronic designs with the JM38510/07906BFA multiplexer & demultiplexer by Texas Instruments. Crafted with precision and quality, this ceramic, glass-sealed component offers 4 functions in a compact rectangular package style. Ideal for military applications, this versatile device provides fast propagation delays, true output polarity, and 3-state output characteristics. Trust Texas Instruments for reliable performance and exceptional value in every project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides high durability and reliability, making the product suitable for harsh environmental conditions.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Functions: 4

Provides versatility and flexibility in signal routing and processing, making it a versatile component.

Nominal Supply Voltage / Vsup (V): 5

Suitable for standard 5V power supply systems, making it compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliable performance in demanding operating environments.

Technology: TTL

Uses TTL technology for fast and efficient signal processing, ensuring high-speed operation.

Technical Specifications

Multiplexer & Demultiplexer JM38510/07906BFA attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.16 mm

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

99 mA

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.73 mm

Trade Compliance

JM38510/07906BFA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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