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74CB3Q3251DBQRE4

Texas Instruments

74CB3Q3251DBQRE4 by Texas Instruments

74CB3Q3251DBQRE4 by Texas Instruments is a CMOS multiplexer with 16 terminals, operating at a supply voltage of 2.5V to 3.6V. It features a propagation delay of 0.18ns and offers 8 outputs in a small outline package, suitable for industrial applications requiring fast switching capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,813 parts In-Stock

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VNN

France . 2,667 parts In-Stock

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2,667

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Vyrian

USA . 789 parts In-Stock

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789

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Ampacity Inc.

Singapore . 227 parts In-Stock

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$8.000

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227

$8.000

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Parana Technologies

USA . 777 parts In-Stock

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$11.004

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$11.466

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777

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AZTECH Wire

Italy . 642 parts In-Stock

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$11.867

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DigiPath Technology Company

USA . 1,630 parts In-Stock

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$12.117

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$12.117

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IDEA Electronic Components Group

UK . 2,319 parts In-Stock

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$12.364

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$11.746

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$11.128

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2,319

$12.364

$11.746

$11.128

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ChromeModa Solutions

Germany . 971 parts In-Stock

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$12.364

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$10.138

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971

$12.364

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Corohmni

South Africa . 869 parts In-Stock

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One Stop Electronics

USA . 710 parts In-Stock

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$29.000

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710

$29.000

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Semicontronic

India . 1,643 parts In-Stock

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$54.000

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$52.650

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$52.380

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Corphita

USA . 2,996 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Argo Parts USA

USA . 430 parts In-Stock

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Continental Prestige Electronics

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Overview

Discover the ultimate solution for your multiplexer & demultiplexer needs with the 74CB3Q3251DBQRE4 by Texas Instruments. Crafted with precision and expertise, this versatile product offers unparalleled performance and reliability. Ideal for a wide range of applications, this device delivers exceptional value, efficiency, and convenience to customers. Upgrade your projects with the quality and advantages that only Texas Instruments can provide. Choose innovation, choose reliability, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it suitable for long-term use.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on printed circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures compatibility with standard board layouts, making it easy to integrate into existing designs.

Nominal Supply Voltage / Vsup (V): 2.5

The low supply voltage requirement makes this product energy-efficient and ideal for applications where power consumption is a concern.

Power Supplies (V): 2.5/3.3

The availability of multiple power supply options provides flexibility in design and compatibility with different voltage systems.

No. of Terminals: 16

With a sufficient number of terminals, this product offers versatile connectivity options for various input and output devices.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The compact and space-saving design of the package allows for efficient use of board space in crowded applications.

Propagation Delay (tpd): 0.18 ns

The low propagation delay ensures fast data transmission, making it suitable for high-speed communication systems.

Maximum Operating Temperature: 85 °C

The high operating temperature range allows this product to function reliably in a wide range of environments, making it versatile and durable.

Output Characteristics: 3-STATE

The 3-state output characteristics provide additional control options, allowing for greater flexibility in system operation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to perform effectively even in extreme cold conditions, enhancing its reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of high-quality terminal finish ensures excellent conductivity and resistance to corrosion, improving the overall performance and longevity of the product.

Terminal Position: DUAL

The dual terminal position offers redundancy and improved signal integrity, making it a reliable choice for critical applications.

Maximum Seated Height: 1.75 mm

The low seated height of the package allows for a compact design, saving valuable space in compact electronic devices.

Width: 3.9 mm

The narrow width of the product enables a high-density layout on the circuit board, contributing to efficient use of space and streamlined design.

Output Polarity: TRUE

The true output polarity ensures consistent and accurate signal transmission, reducing the risk of errors and improving overall system performance.

Technical Specifications

Multiplexer & Demultiplexer 74CB3Q3251DBQRE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inputs:

1

No. of Outputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

.18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74CB3Q3251DBQRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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