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74CB3Q3253DBQRG4

Texas Instruments

74CB3Q3253DBQRG4 by Texas Instruments

The Texas Instruments 74CB3Q3253DBQRG4 is a CMOS multiplexer/demultiplexer with 2 functions, 0.12 ns propagation delay, and 16 terminals. It operates at a voltage range of 2.3V to 3.6V and is ideal for industrial applications requiring fast signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,589 parts In-Stock

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Euro-Tech

UK . 2,445 parts In-Stock

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Digiode

USA . 1,812 parts In-Stock

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1,812

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Distributors (Availability)

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Native Components

USA . 341 parts In-Stock

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$0.037

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$0.035

341

$0.037

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$0.035

Parana Technologies

USA . 897 parts In-Stock

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$11.716

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$12.107

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897

$11.716

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$12.107

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DigiPath Technology Company

USA . 745 parts In-Stock

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$12.901

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$11.869

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745

$12.901

$11.869

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ChromeModa Solutions

Germany . 3,296 parts In-Stock

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$13.164

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$10.794

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3,296

$13.164

$10.794

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IDEA Electronic Components Group

UK . 1,814 parts In-Stock

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$13.164

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$12.506

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$11.848

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1,814

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$11.848

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AZTECH Wire

Italy . 219 parts In-Stock

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$15.615

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One Stop Electronics

USA . 1,601 parts In-Stock

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$52.000

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Northwest PG Solutions

USA . 1,869 parts In-Stock

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Microchip USA

USA . 1,565 parts In-Stock

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Corphita

USA . 674 parts In-Stock

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Overview

Elevate your electronic designs with the 74CB3Q3253DBQRG4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers once again with this multiplexer & demultiplexer. Perfect for a wide range of applications, this versatile component offers customers unmatched value and benefits. With fast propagation delay, low power consumption, and high temperature tolerance, this product is a game-changer in the world of electronics. Upgrade your projects today with the 74CB3Q3253DBQRG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the multiplexer & demultiplexer, making it suitable for long-term use.

Propagation Delay At Nominal Supply: 0.12 ns

Low propagation delay ensures fast data transmission, making this product ideal for high-speed applications where timing is critical.

Surface Mount: YES

Surface mount capability allows for easy and secure installation of the multiplexer & demultiplexer onto circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having 2 functions (multiplexer & demultiplexer) in one component offers versatility and flexibility in signal routing and management within electronic systems.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard nominal supply voltage of 2.5V, ensuring compatibility with most electronic devices and power sources.

Technology: CMOS

CMOS technology utilized in the design of this product ensures low power consumption, high speed performance, and reliable operation, making it an efficient choice for various applications.

Technical Specifications

Multiplexer & Demultiplexer 74CB3Q3253DBQRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Inputs:

1

No. of Outputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

1.5 mA

Propagation Delay At Nominal Supply:

.12 ns

Propagation Delay (tpd):

.18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74CB3Q3253DBQRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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