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SN74153N

Texas Instruments

SN74153N by Texas Instruments

SN74153N by Texas Instruments is a TTL multiplexer/demultiplexer with 2 functions and 4 inputs. It operates at a supply voltage of 5V, has a propagation delay of 23ns, and can handle load capacitance of 30pF. This IC is commonly used in commercial applications requiring signal routing and selection in electronic circuits.

Median Price

$1.017

Lifecycle Status

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48

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Rochester

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TEDSS.com

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Forefront Electronics and Design

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Corphita

USA . 1,943 parts In-Stock

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$0.722

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Component Stockers USA

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$0.820

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$0.770

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Microchip USA

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Parana Technologies

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DigiPath Technology Company

USA . 1,037 parts In-Stock

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ChromeModa Solutions

Germany . 4,658 parts In-Stock

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IDEA Electronic Components Group

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Overview

Enhance your electronic projects with the SN74153N by Texas Instruments, a high-quality multiplexer/demultiplexer that offers unparalleled performance and reliability. With its durable plastic/epoxy package body and cutting-edge technology, this component is ideal for a wide range of applications. From data transmission to signal routing, the SN74153N ensures seamless operation and precise output control. Trust in Texas Instruments' reputation for excellence and unlock the full potential of your designs with the SN74153N. Upgrade your circuits today and experience the benefits of this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring a longer lifespan.

No. of Functions: 2

Having 2 functions in one device makes it versatile and cost-effective, reducing the need for multiple separate components.

No. of Inputs: 4

With 4 inputs, this product allows for multiple signals to be processed simultaneously, increasing efficiency and flexibility in data handling.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with most systems and easy to integrate.

Load Capacitance (CL): 30 pF

The low load capacitance of 30 pF ensures fast signal processing and minimal signal distortion, providing accurate data transmission.

Propagation Delay (tpd): 23 ns

The short propagation delay of 23 ns ensures quick response times, ideal for applications that require real-time data processing.

Temperature Grade: COMMERCIAL

Suitable for commercial use, this product meets standard industry requirements and can operate within a specified temperature range.

Technology: TTL

Utilizing TTL technology, this multiplexer/demultiplexer ensures reliable and stable signal processing, making it a trusted choice for various electronic applications.

Technical Specifications

Multiplexer & Demultiplexer SN74153N attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

60 mA

Propagation Delay (tpd):

23 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74153N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-172-5586, 5962001725586, 5962-01-072-8627, 5962010728627

NIIN

001725586, 010728627

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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