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SN74AS257DE4

Texas Instruments

SN74AS257DE4 by Texas Instruments

SN74AS257DE4 by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 6ns at 5V. It features a small outline package style and operates b/w 0-70°C. Ideal for applications requiring high-speed signal switching in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,809 parts In-Stock

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4,809

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Digiode

USA . 912 parts In-Stock

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912

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 280 parts In-Stock

1+ parts

$5.268

100+ parts

-

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280

$5.268

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One Stop Electronics

USA . 140 parts In-Stock

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$6.000

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140

$6.000

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Parana Technologies

USA . 2,318 parts In-Stock

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$15.013

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$15.430

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2,318

$15.013

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$15.430

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DigiPath Technology Company

USA . 1,928 parts In-Stock

1+ parts

$16.532

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$15.209

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1,928

$16.532

$15.209

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ChromeModa Solutions

Germany . 3,669 parts In-Stock

1+ parts

$16.869

100+ parts

$13.833

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3,669

$16.869

$13.833

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IDEA Electronic Components Group

UK . 624 parts In-Stock

1+ parts

$16.869

100+ parts

$16.026

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$15.182

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624

$16.869

$16.026

$15.182

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Corphita

USA . 3,974 parts In-Stock

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3,974

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Overview

Experience unparalleled performance and reliability with the Texas Instruments SN74AS257DE4 multiplexer/demultiplexer. Designed with precision in mind, this versatile component offers seamless integration into a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product delivers superior quality and durability. Unlock the potential of your projects with the SN74AS257DE4, providing exceptional value and efficiency to meet all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the internal components of the multiplexer/demultiplexer, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast signal processing, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

Surface-mount capability enables easy integration onto PCBs, saving space and facilitating automated assembly processes.

No. of Functions: 4

Having 4 functions in a single component allows for efficient signal routing and management in complex electronic systems.

Nominal Supply Voltage: 5V

Operates at a common 5V voltage, making it compatible with standard power supplies and easy to integrate into existing circuits.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions or during extended operation.

Output Characteristics: 3-STATE

3-STATE output allows the multiplexer/demultiplexer to provide high impedance when disabled, reducing power consumption and signal interference.

Technology: TTL

TTL technology offers compatibility with a wide range of digital systems, ensuring seamless integration and reliable signal processing.

Technical Specifications

Multiplexer & Demultiplexer SN74AS257DE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AS

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

48 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30.6 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74AS257DE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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