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SN54HC352FK-00

Texas Instruments

SN54HC352FK-00 by Texas Instruments

SN54HC352FK-00 by Texas Instruments is a CMOS multiplexer with 2 functions and 4 inputs. It operates at a supply voltage range of 2V to 6V, with a propagation delay of 82ns. Ideal for military-grade applications requiring inverted output polarity in a square chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,434 parts In-Stock

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Digiode

USA . 2,796 parts In-Stock

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2,796

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Distributors (Availability)

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One Stop Electronics

USA . 192 parts In-Stock

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$9.000

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192

$9.000

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Parana Technologies

USA . 1,060 parts In-Stock

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$10.607

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$985.023

1k+ parts

$9.546

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-

1,060

$10.607

$985.023

$9.546

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DigiPath Technology Company

USA . 1,878 parts In-Stock

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$11.680

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$10.745

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1,878

$11.680

$10.745

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AZTECH Wire

Italy . 754 parts In-Stock

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$11.691

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754

$11.691

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ChromeModa Solutions

Germany . 4,709 parts In-Stock

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$11.918

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$9.773

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4,709

$11.918

$9.773

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IDEA Electronic Components Group

UK . 1,450 parts In-Stock

1+ parts

$11.918

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$11.322

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$10.726

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1,450

$11.918

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$10.726

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Corphita

USA . 4,639 parts In-Stock

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Overview

Enhance your electronic designs with the SN54HC352FK-00 by Texas Instruments, a high-quality multiplexer & demultiplexer chip that offers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this versatile component is perfect for a wide range of applications. With advanced technology and precision engineering, this chip delivers exceptional value, benefits, and advantages to customers looking for top-notch quality in their projects. Upgrade your circuits today with the SN54HC352FK-00 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability for the product.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards.

No. of Functions: 2

With 2 functions in one device, it provides versatile and efficient multiplexing and demultiplexing capabilities.

Propatation Delay (tpd): 82 ns

The low propagation delay of 82 ns ensures fast and efficient data processing.

Temperature Grade: MILITARY

Designed to withstand extreme temperatures, making it suitable for military and rugged applications.

Technical Specifications

Multiplexer & Demultiplexer SN54HC352FK-00 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

82 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SN54HC352FK-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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