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CD40257BE

Texas Instruments

CD40257BE by Texas Instruments

CD40257BE by Texas Instruments is a 4-function, 2-input multiplexer with 140ns propagation delay at 5V. It operates in a temperature range of -55 to 125°C and has a max power supply current of 3mA. Ideal for military-grade applications requiring CMOS technology and true output polarity.

Median Price

$1.325

Lifecycle Status

Suppliers In-Stock

36

In-Stock Inventory

1k+

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Mouser Electronics

USA . 456 parts In-Stock

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Adafruit Industries

USA . 2,500 parts In-Stock

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$15.751

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Rochester

USA . 17,569 parts In-Stock

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$1.280

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DigiKey

USA . 17,569 parts In-Stock

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Verical

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Chip1Stop

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Arrow

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Digiode

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American Microsemiconductor Inc.

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DigiKey Marketplace

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Semicontronic

India . 6,291 parts In-Stock

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$0.660

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$0.644

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$0.640

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Component Stockers USA

USA . 24,233 parts In-Stock

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$0.810

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$0.760

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$0.610

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$0.610

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Corphita

USA . 362 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$16.580

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Parana Technologies

USA . 1,548 parts In-Stock

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$39.686

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DigiPath Technology Company

USA . 1,034 parts In-Stock

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ChromeModa Solutions

Germany . 5,046 parts In-Stock

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IDEA Electronic Components Group

UK . 1,726 parts In-Stock

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Corohmni

South Africa . 474 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Supply Digital

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Montclair Electronics, Inc.

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Overview

Elevate your electronic projects to the next level with the reliable CD40257BE by Texas Instruments. Crafted with precision and expertise, this Multiplexer & Demultiplexer offers unparalleled quality and performance. Perfect for a wide range of applications, this product boasts 4 functions, 2 inputs, and a fast propagation delay of just 140 ns. Whether you're a seasoned professional or a hobbyist, this versatile component provides exceptional value, benefits, and advantages that will exceed your expectations. Trust Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable, lightweight, and cost-effective, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 140 ns

Low propagation delay ensures fast and efficient data transmission, making the product ideal for high-speed applications.

No. of Functions: 4

Having 4 functions in one device increases the versatility and functionality of the product, making it a cost-effective solution.

No. of Inputs: 2

2 inputs allow for data selection and routing, providing flexibility in signal processing and routing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with common electronic systems and power sources.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, the product is suitable for use in challenging environments and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Multiplexer & Demultiplexer CD40257BE attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

1.5 Amp

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

3 mA

Propagation Delay At Nominal Supply:

140 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD40257BE Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-296-9144, 5962012969144, 5962-01-299-5397, 5962012995397, 5962-21-890-8455, 5962218908455

NIIN

012969144, 012995397, 218908455

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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